Copper foil tin plating

Copper foil tin plated products are widely used in the electrical and electronic industries, such as printed circuit boards, passive components, 3C electronic products, and other fields. In addition, due to its non-toxic and odorless properties, it is widely used in the food industry, such as beverage packaging and tools that come into contact with food. Copper foil tin plated products play an important role in the modern electronics industry due to their excellent conductivity, corrosion resistance, weldability, and mechanical properties.

Product characteristics

1. Excellent conductivity: Copper foil serves as a conductive layer, ensuring that tin plated copper foil products have good conductivity and can meet the high requirements of electronic devices for conductivity.

2. Good corrosion resistance: Tin plating can form a dense tin dioxide film in air, effectively preventing further oxidation of copper foil and improving the corrosion resistance of the product. In addition, the tin layer can also form a thin film in a halogen environment, further enhancing its corrosion resistance.

3. Weldability: Tin plated copper foil has good weldability, which can meet the welding requirements in the manufacturing process of electronic products, improve production efficiency and product quality. According to customer requirements, the tin content in the tin plating layer can be adjusted between 65% and 92% to meet different welding process requirements.

4. Strength and hardness: Tin plating also endows copper foil with certain strength and hardness, making it more stable and reliable during application.

5. Non toxic and odorless: Tin metal is non-toxic and odorless, so tin plated copper foil products are widely used in industries such as food that require non-toxic materials.

Production process

1. Material preparation: Select high-purity copper as the substrate and perform cutting and cleaning treatment.

2. Surface treatment: Chemical or mechanical methods are used to treat the surface of copper foil to increase the adhesion between the tin plating layer and the copper foil.

3. Tin plating treatment: A uniform and dense layer of tin is deposited on the surface of copper foil by electroplating or chemical plating methods.

4. Post processing: Clean, dry, and inspect the tinned copper foil to ensure the stability and consistency of product quality.

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