PI Copper Plating and Tin Plating

PI copper plated tin plated film is a high-performance composite material that combines the excellent properties of polyimide (PI) film with the conductivity and corrosion resistance of metal copper and tin, forming a material with broad application prospects in multiple fields such as electronics, aerospace, medical equipment, etc.

Product characteristics

1. Excellent conductivity: The copper coating endows the PI copper plated tin plated film with excellent conductivity, enabling smooth current conduction in the material, reducing energy loss, and improving the response speed and operating efficiency of electronic products.

2. High temperature stability: The excellent high temperature stability of PI substrate enables PI copper plated tin plated film to maintain stable performance in high temperature environments, without deformation or damage, making it suitable for applications that require high temperature resistance.

3. Good corrosion resistance: Tin plating has good corrosion resistance to various chemicals, which can effectively prevent the corrosion and damage of copper layers and PI substrates in harsh environments, and extend the service life of products.

4. Easy to solder: The tin coating improves the welding performance of the material, making it easy to solder PI copper plated tin plated film in the manufacturing and maintenance process of electronic products, improving production efficiency and product quality.

5. Excellent bending resistance: The excellent mechanical properties of PI substrate make PI copper plated tin plated film have good bending resistance, which can adapt to various complex bending and twisting environments, ensuring the stability and reliability of the product.

Production process

1. PI film preparation: High quality PI films are prepared as substrates through specific processes.

2. Copper plating treatment: A uniform and dense copper layer is deposited on the surface of PI film by electroplating or chemical plating methods.

3. Tin plating treatment: Continuing to deposit a uniform and dense layer of tin on the surface of the copper layer through electroplating or chemical plating methods.

4. Post treatment: Clean, dry, and cure the PI film after copper plating and tin plating to ensure the stability and consistency of product quality.

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