PI tin plated film

PI tin plated film is a composite material that combines polyimide (PI) film and tin coating. PI tin plated film is a high-performance and widely used composite material. Its unique conductivity, heat resistance, and corrosion resistance make it have broad application prospects in the field of electronics and other high demand areas.

Product characteristics

1. Excellent conductivity: PI tin plated film can achieve good conductivity by adjusting the thickness of the tin plating layer, meeting the conductivity requirements of various electronic products.

2. Reflow soldering: PI tin plated film has good heat resistance and can withstand the soldering process in high temperature environments, such as reflow soldering, ensuring the stability and reliability of the soldering process.

3. Excellent heat resistance: The PI substrate itself has excellent high-temperature stability, which can withstand high temperature environments without deformation or damage, and the tin coating further enhances its heat resistance.

4. Excellent corrosion resistance: Tin plating has good corrosion resistance to various chemicals, which can protect PI substrates from corrosion and prolong the service life of materials.

5. Excellent bending resistance: PI tin plated film has good flexibility and can withstand multiple bends without easily breaking, making it suitable for occasions that require frequent bending.

Production process

1. Substrate preparation: Select high-quality PI film as the substrate and perform pre-treatment work such as cleaning and drying.

2. Tin plating treatment: Tin layer is deposited on the surface of PI film by electroplating or chemical plating methods. The choice of specific methods depends on factors such as the specific requirements of the product and production costs.

3. Post treatment: Dry and cure the PI film after tin plating to ensure that the tin layer adheres firmly and the surface is smooth and flat.

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