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Silver conductive paste
Silver platinum conductor paste
  • Silver platinum conductor paste
  • Silver platinum conductor paste
  • Silver platinum conductor paste
  • Silver platinum conductor paste

Silver platinum conductor paste

Silver platinum conductor paste provides an important solution for electronic manufacturing due to its excellent conductivity, high temperature resistance, and good adhesion. It not only improves the conductivity and stability of electronic components, but also reduces manufacturing costs and meets environmental standards. In the future, with the continuous development of electronic technology, this conductor paste will play a key role in more fields and promote the progress of electronic manufacturing technology.

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+86-13826586185

Silver platinum conductor paste is a high-performance conductive material designed specifically for applications such as thick film circuits, potentiometers, and ferrite electrodes in electronic manufacturing. This silver paste is made of high-quality silver powder, platinum powder, and special resin matrix, and is processed through fine mixing and dispersion techniques. It provides excellent conductivity and high temperature resistance, suitable for various substrates such as ceramics, metals, glass, etc.
    银铂导体浆料

Product characteristics

  1. High conductivity: The high content of silver and platinum ensures that the conductive layer has extremely low resistivity and improves conductivity.
  2. High temperature resistance: containing platinum components, able to withstand high temperatures, suitable for high-temperature working environments.
  3. Good adhesion: The resin matrix has good adhesion, ensuring stable adhesion of silver platinum paste on various substrates.
  4. Environmental friendliness: The product complies with RoHS standards, does not contain halogens and other harmful substances, and is environmentally friendly.
  5. Good processability: It has good fluidity and thixotropy, suitable for various processes such as screen printing.

Product advantages

  1. Improving conductivity: High silver platinum content ensures excellent conductivity and is suitable for various electronic components.
  2. High temperature resistance: The addition of platinum improves the high temperature resistance performance and is suitable for electronic components working in high-temperature environments.
  3. Enhancing circuit stability: The cured conductive layer has high reliability, enhancing the stability and service life of electronic components.
  4. Cost reduction: Excellent adhesion reduces defects in the manufacturing process and lowers manufacturing costs.
  5. Environmentally friendly and pollution-free: Complies with environmental standards, with no harmful gas release during use, and is environmentally friendly.

银铂导体浆料
application area

  1. Thick film circuit:
    • The conductive layer used in thick film circuits provides high conductivity and good adhesion.
    • Circuit boards suitable for various electronic devices.
  2. Potentiometer:
    • Used for potentiometer terminal conductors to improve the reliability of signal transmission.
    • Suitable for various audio devices, mixing consoles, etc.
  3. Ferrite electrode:
    • The conductive layer used for ferrite electrodes provides high conductivity and good adhesion.
    • Suitable for ferrite cores, transformers, etc.
  4. Other applications:
    • Used for conductive connections in fields such as automotive electronics and smart homes, providing high reliability and high temperature resistance.

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Lead free and cadmium free environmentally friendly medium temperature silver paste, suitable for thick film hybrid integrated circuits, leads and electrodes for separated components, internal connections and terminal leads for medium temperature fired circuits, electrodes for semiconductor ceramic devices, etc..

TECHNICAL INDEX

product number

Solid content(%

Fineness(μm

Viscosity(Pa·s

XJY-Ag-5310

79-83

< 12.5

550-700

Recommended Process for Use

product number

Drying temperature(℃)

Drying time (min)

Burning conditions

Peak(℃)

cycle(min)

Insulation time (min)

XJY-Ag-5310

120-150

10-15

500-600

30

8-10

performance index

product number

Burn film thickness(μm

sheet resistivity

mΩ/□)

Adhesion(vertical)

N/2×2mm2

solderability

XJY-Ag-5310

7-15

<5

15

excellent(soldering iron)

precautions

Before use, please stir the slurry evenly for 10-20 minutes.

This slurry is a ready to use product and does not need to be diluted. If dilution is required, the amount added cannot exceed 3% (weight ratio). Excessive dilution will directly affect the performance of the slurry.

Storage conditions: 5-25 ℃, usage period: 6 months.

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