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Silver conductive paste
Silver palladium conductor paste
  • Silver palladium conductor paste
  • Silver palladium conductor paste
  • Silver palladium conductor paste
  • Silver palladium conductor paste

Silver palladium conductor paste

Silver palladium conductor paste has shown extensive application potential in the field of electronic manufacturing due to its excellent conductivity, high temperature resistance, and good adhesion. It not only improves the conductivity and stability of electronic components, but also meets the requirements of high temperature and reliability. With the continuous development of electronic technology, this conductor paste will play a key role in more high-end applications, promoting the progress of electronic manufacturing technology.

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+86-13826586185

Silver palladium conductor paste is a high-performance conductive material designed specifically for high-end applications in electronic manufacturing. This slurry uses high-quality silver powder and palladium powder as the main conductive components, combined with a special resin matrix, and is made through fine stirring and dispersion processes. It has excellent conductivity, high temperature resistance, and good adhesion, and is suitable for various substrates such as ceramics, metals, glass, and polymer materials.
银钯导体浆料

Product characteristics

  1. Excellent conductivity: The high content of silver palladium alloy ensures that the conductive layer has extremely low resistivity, significantly improving the conductivity performance.
  2. Excellent high temperature resistance: The addition of palladium enables the slurry to withstand high temperature environments and maintain stable conductivity.
  3. Excellent adhesion: The resin matrix provides good adhesion, ensuring stable adhesion of silver palladium slurry on various substrates.
  4. Inhibition of silver ion migration: The addition of palladium effectively suppresses the migration of silver ions in high temperature and high humidity environments, enhancing the stability of the conductive film.
  5. Good process adaptability: The slurry has excellent fluidity and thixotropy, suitable for various processes such as screen printing and spraying.

Product advantages

  1. Improving conductivity: High silver palladium content ensures excellent conductivity of the paste, meeting the needs of high-end electronic components.
  2. Enhance high temperature resistance: The addition of palladium enables the slurry to maintain stable conductivity in high temperature environments, expanding its application range.
  3. Improving circuit stability: The cured conductive layer has high reliability, which can enhance the stability of electronic components and extend their service life.
  4. Cost reduction: Excellent adhesion and process adaptability reduce defects in the manufacturing process, helping to lower manufacturing costs.
  5. Environmentally friendly and pollution-free: The product meets environmental standards and does not release harmful gases during use, making it environmentally friendly.

银钯导体浆料
application area

  1. High end electronic devices: used for thick film circuits and sensor conductive layers in high-end electronic devices, providing excellent conductivity and high temperature resistance.
  2. Automotive electronics: Used in the field of automotive electronics for conductive connection parts that meet high temperature and reliability requirements.
  3. Aerospace: Used in electronic devices in the aerospace field to withstand the electrical conductivity requirements under extreme environmental conditions.
  4. Industrial control: Used for conductive components in industrial control equipment to ensure stable signal transmission.
  5. Other high-end applications: Suitable for other high-end application fields that require high conductivity, high temperature resistance, and reliability.

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technical data

Features: Lead free, cadmium free, high-temperature sintering, high conductivity, excellent adhesion to 96% alumina ceramic substrate.

scope of application

Suitable for thick film hybrid integrated circuits, circuit leads and electrodes for separated components, internal connections and terminal leads for high-temperature fired circuits, electrodes for semiconductor ceramic devices, etc.

Technical indicators of pulp

product number

Solid content%

Viscosity Pa · s

Fineness µ m

PC-Ag-8110

79-82

500±100

<10

Usage process

Screen mesh/mask thickness: 325 mesh/25 µ m

Leveling time (LEVELING TIME): 5-10 minutes at 25 ℃

Drying conditions: 125 ℃/10-15 minutes

Firing Temperature: 850 ℃± 10 ℃

Time at Peak Package Temperature (TIME AT PEAK): 10-12 minutes

Rate of Heating/Cooling: 60-100 ℃/minutes

Total Cycle: 45-60 minutes

Substrate specification: 96% alumina

Thinner: Pineol

performance index

Product brand

Printing resolution

µm

Square obstruction

mΩ/□

Sintering thickness

µm

solderability

220℃±5℃

Peel off adhesion

N/2×2mm

  8110

125×125

5-15

7-15

excellent

>40

precautions

1. Safe use: If the slurry is accidentally swallowed, inhaled, or comes into contact with the skin, it is harmful. Therefore, it should be thoroughly cleaned immediately after use. Avoid contact with eyes, skin, or clothing, and do not approach fire or combustibles. Because it is flammable, it should be covered tightly when not in use to avoid inhaling volatile gases, and air circulation should be maintained during use.

2. This slurry is a ready to use product and does not need to be diluted. If dilution is required, the amount added should not exceed 3% (weight ratio). Excessive diluent will directly affect the performance of the slurry.

3. The thickness of the printed circuit itself cannot be less than 4 μ m, otherwise the conductivity will be unstable.

4. This slurry should be stored in a cool and dry place between 4-25 ℃.

5. Storage period: Sealed in original packaging for six months.

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