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Silver palladium conductor paste has shown extensive application potential in the field of electronic manufacturing due to its excellent conductivity, high temperature resistance, and good adhesion. It not only improves the conductivity and stability of electronic components, but also meets the requirements of high temperature and reliability. With the continuous development of electronic technology, this conductor paste will play a key role in more high-end applications, promoting the progress of electronic manufacturing technology.
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Silver palladium conductor paste is a high-performance conductive material designed specifically for high-end applications in electronic manufacturing. This slurry uses high-quality silver powder and palladium powder as the main conductive components, combined with a special resin matrix, and is made through fine stirring and dispersion processes. It has excellent conductivity, high temperature resistance, and good adhesion, and is suitable for various substrates such as ceramics, metals, glass, and polymer materials.
Product characteristics
Product advantages
application area
workshop show
technical data
Features: Lead free, cadmium free, high-temperature sintering, high conductivity, excellent adhesion to 96% alumina ceramic substrate.
scope of application
Suitable for thick film hybrid integrated circuits, circuit leads and electrodes for separated components, internal connections and terminal leads for high-temperature fired circuits, electrodes for semiconductor ceramic devices, etc.
Technical indicators of pulp
product number |
Solid content% |
Viscosity Pa · s |
Fineness µ m |
PC-Ag-8110 |
79-82 |
500±100 |
<10 |
Usage process
Screen mesh/mask thickness: 325 mesh/25 µ m
Leveling time (LEVELING TIME): 5-10 minutes at 25 ℃
Drying conditions: 125 ℃/10-15 minutes
Firing Temperature: 850 ℃± 10 ℃
Time at Peak Package Temperature (TIME AT PEAK): 10-12 minutes
Rate of Heating/Cooling: 60-100 ℃/minutes
Total Cycle: 45-60 minutes
Substrate specification: 96% alumina
Thinner: Pineol
performance index
Product brand |
Printing resolution µm |
Square obstruction mΩ/□ |
Sintering thickness µm |
solderability 220℃±5℃ |
Peel off adhesion N/2×2mm |
8110 |
125×125 |
5-15 |
7-15 |
excellent |
>40 |
precautions
1. Safe use: If the slurry is accidentally swallowed, inhaled, or comes into contact with the skin, it is harmful. Therefore, it should be thoroughly cleaned immediately after use. Avoid contact with eyes, skin, or clothing, and do not approach fire or combustibles. Because it is flammable, it should be covered tightly when not in use to avoid inhaling volatile gases, and air circulation should be maintained during use.
2. This slurry is a ready to use product and does not need to be diluted. If dilution is required, the amount added should not exceed 3% (weight ratio). Excessive diluent will directly affect the performance of the slurry.
3. The thickness of the printed circuit itself cannot be less than 4 μ m, otherwise the conductivity will be unstable.
4. This slurry should be stored in a cool and dry place between 4-25 ℃.
5. Storage period: Sealed in original packaging for six months.
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