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Polymer silver paste is a new type of conductive material designed specifically for various applications in electronic manufacturing. This silver paste is made by combining high-quality silver powder with a polymer resin matrix through fine stirring and dispersion processes. It has excellent conductivity, flexibility, and good adhesion, and is suitable for various flexible substrates such as plastic films, flexible circuit boards, etc.
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Polymer silver paste is mainly made by mixing components such as flake silver powder, resin, and solvent through special processes. It combines the high conductivity of silver with the good mechanical properties of polymers to form a conductive paste with excellent conductivity, processability, and adhesion.
Product characteristics
application area
workshop show
Polymer silver paste is an excellent conductive material widely used in the electronics industry, which can be screen printed, used to make various electrodes or printed electrode circuits. The conductive layer after heat curing has good adhesion and conductivity.
TECHNICAL INDEX
product number |
Solid content(%) |
Fineness(μm) |
Viscosity(Pa·s) |
XJY-Ag-8958 |
75-78 |
< 20 |
30-80 |
Recommended Process for Use
Mesh size (mesh) |
Curing temperature(℃) |
Curing time (min) |
180-200 |
180-210 |
25-30 |
performance index
Film thickness(μm) |
Square obstruction(mΩ/□ |
Adhesion |
8-10 |
<40 |
good |
precautions
Before use, please stir the slurry evenly (stir for at least five minutes)
Storage conditions: 5-25 ℃, service life: 6 months
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