Inner layer silver conductor paste is a high-performance conductive material designed specifically for multilayer circuit boards (MLBs) in electronic manufacturing. This silver paste is made of high-quality silver powder and special resin matrix, and is processed through fine mixing and dispersion techniques. It is mainly used as a conductive layer for interlayer connections inside multi-layer circuit boards, providing excellent conductivity and good adhesion, suitable for various substrates such as PI film, PET film, etc.
Product characteristics
- High conductivity: The silver powder content is high, ensuring that the conductive layer has extremely low resistivity and improving conductivity.
- Excellent adhesion: The resin matrix has good adhesion, ensuring stable adhesion of silver paste on various substrates.
- Good interlayer adhesion: The cured conductive layer can tightly adhere to other layers, improving the overall strength of the circuit board.
- Environmental friendliness: The product complies with RoHS standards, does not contain halogens and other harmful substances, and is environmentally friendly.
- Good processability: It has good fluidity and thixotropy, suitable for various processes such as screen printing.
Product advantages
- Improving conductivity: High silver powder content and excellent adhesion ensure excellent conductivity.
- Enhance the stability of the circuit board: The cured conductive layer has high reliability, enhancing the stability and service life of multi-layer circuit boards.
- Cost reduction: Excellent adhesion and interlayer bonding reduce defects in the manufacturing process and lower manufacturing costs.
- Environmentally friendly and pollution-free: Complies with environmental standards, with no harmful gas release during use, and is environmentally friendly.
application area
- Multilayer circuit board:
- A conductive layer used for interlayer connections within multi-layer circuit boards (MLBs), providing high conductivity and good interlayer adhesion.
- Suitable for high-density assembly of electronic devices such as smartphones and computers.
- Flexible circuit board:
- Used for the internal conductive layer of flexible circuit boards (FPC), providing high reliability and bending resistance.
- Suitable for flexible circuit board manufacturing in wearable devices, automotive electronics, and other fields.
- Sensor:
- Used as a conductive layer for temperature sensors, humidity sensors, pressure sensors, etc., to improve the reliability of signal transmission.
- Suitable for industrial automation and IoT devices.
- Other applications:
- Used for conductive connections in fields such as automotive electronics and smart homes, providing high reliability and bending resistance.
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