Low temperature sintered LTCC conductive silver paste is a high-performance conductive silver paste designed specifically for low-temperature co fired ceramic (LTCC) technology. This silver paste is made of high-quality silver powder and high polymer resin, and is processed through fine mixing and dispersion techniques. It can be quickly cured and sintered under low temperature conditions, forming a highly conductive layer, especially suitable for temperature sensitive LTCC substrates. Widely used in low-temperature co fired ceramic (LTCC) technology for making multi-layer ceramic circuit boards and microwave circuit components.
Product characteristics
- High conductivity: The silver powder content is high, ensuring that the conductive layer has extremely low resistivity and improving conductivity.
- Low temperature sintering: Sintering can be completed at lower temperatures (such as 650-850 ° C) to reduce thermal damage to the substrate.
- Excellent adhesion performance: The resin matrix has good adhesion performance and is suitable for various substrates such as ceramics, glass, etc.
- Good processability: It has good fluidity and thixotropy, suitable for processes such as screen printing and inkjet printing.
- Environmental friendliness: The product complies with RoHS standards and does not contain harmful substances such as lead.
Product advantages
- Improving production efficiency: Low temperature sintering reduces curing time and enhances production efficiency.
- Enhancing the stability of electronic components: The conductive layer formed after curing has high reliability, enhancing the stability and service life of electronic components.
- Cost reduction: Low temperature sintering reduces energy consumption, minimizes thermal damage to the substrate, and lowers production costs.
- Environmentally friendly and pollution-free: Complies with environmental standards, with no harmful gas release during use, and is environmentally friendly.
application area
- Low temperature co fired ceramics (LTCC):
- Used as a conductive layer for multi-layer ceramic circuit boards and microwave circuit components to improve the conductivity and stability of circuits.
- Suitable for communication equipment, radar systems, wireless communication modules, etc.
- Microwave circuit components:
- Conductive layer used for microwave circuit components such as microwave filters, antennas, couplers, etc.
- Suitable for various microwave communication devices.
- Electronic packaging:
- Used for conductive connections of electronic components such as integrated circuit packaging and sensor packaging.
- Suitable for fields such as automotive electronics and smart homes.
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