Low temperature cured conductive silver paste for electronic packaging is a high-performance conductive material designed specifically for the electronic packaging industry. This silver paste is made of high-quality silver powder and high polymer resin, and is processed through fine mixing and dispersion techniques. It can quickly cure at low temperatures, forming a highly conductive layer, especially suitable for temperature sensitive electronic components. Widely used in fields such as integrated circuit packaging, LED packaging, photovoltaic cells, and printed circuit boards.

Product characteristics

1. Low temperature curing: It can be cured at lower temperatures (such as 120-150 ℃) to reduce thermal damage to the substrate.
2. High conductivity: The silver powder content is high, ensuring that the conductive layer has extremely low resistivity and improving conductivity.
3. Excellent adhesion performance: The resin matrix has good adhesion performance and is suitable for various substrates such as metals, ceramics, glass, etc.
4. Good processability: It has good fluidity and thixotropy, making it easy for coating and screen printing operations.
5. Environmental friendliness: The product complies with RoHS standards and does not contain harmful substances such as lead.

Product advantages

1. Improve production efficiency: Low temperature curing reduces curing time and improves production efficiency.
2. Enhancing the stability of electronic components: The conductive layer formed after curing has high reliability, enhancing the stability and service life of electronic components.
3. Cost reduction: Low temperature curing reduces energy consumption, minimizes thermal damage to the substrate, and lowers production costs.
4. Environmentally friendly and pollution-free: Complies with environmental standards, with no harmful gas release during use, and is environmentally friendly.

Production process

1. Raw material preparation: Accurately weigh high-quality silver powder, resin matrix, solvents, and other additivesAdditive.
2. Mixing and Stirring: Use a high-speed mixer to mix the raw materials evenlyEnsure that all components are fully dispersed.
3. Filtration purification: removing impurities from the slurry through fine filtrationAnd particles to ensure the purity of the slurry.
4. Coating: Apply the slurry evenly onto the substrateIt can be done through spraying, screen printing, and other methods.
5. Curing: According to the product manualOperate under the curing conditions to ensure complete solidification of the conductive silver paste.

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