Low temperature conductive silver paste

Low temperature conductive silver paste is a high-performance conductive material designed specifically for low-temperature curing environments. It is composed of ultrafine silver powder, organic polymer binder phase, organic solvent, and other additives. This product can quickly cure at lower temperatures and is suitable for substrates that are not resistant to high temperatures, such as PET films, flexible circuit boards, etc. Low temperature conductive silver paste has excellent conductivity and good adhesion, and is widely used in various fields such as electronics, photovoltaics, touch screens, etc., meeting the modern electronic industry's demand for high-performance conductive materials.

Product characteristics

1. Low temperature curing: It can cure quickly at lower temperatures, usually below 200 ℃.
2. Excellent conductivity: Using ultrafine silver powder to ensure excellent conductivity.
3. Good adhesion: It has good adhesion to various substrates, ensuring the reliability of the connection.
4. Bending resistance: Some products have good bending resistance and are suitable for the manufacturing of flexible electronic products.
5. Printing adaptability: It has good printing performance and is suitable for the production of fine circuits.

Product advantages

1. Energy saving and environmental protection: Low temperature curing reduces energy consumption and conforms to the concept of green production.
2. Strong applicability: Suitable for various substrates, expanding the application field.
3. Stable performance: Stable conductivity ensures the reliability and stability of electronic products.
4. Simple production process: Low curing temperature simplifies the production process and reduces costs.

Production process

1. Raw material preparation: Select high-purity silver powder, organic polymer binder phase, organic solvents, and other additives.
2. Pre mixing: Mix silver powder, binder phase, solvent and other raw materials uniformly in a certain proportion.
3. Grinding and dispersion: Using high-precision grinding equipment to evenly disperse silver powder in the bonding phase, ensuring conductivity.
4. Filtering and impurity removal: Remove impurities through filtering equipment to ensure the purity of the slurry.
5. Curing treatment: Curing treatment is carried out under low temperature conditions to ensure the performance of the conductive film layer.

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