PI gold-plated filmIt is a composite material made by depositing a layer of gold on the surface of polyimide (PI) substrate through precision technology. This material combines the excellent mechanical, electrical, and heat resistance of polyimide with the high conductivity, oxidation resistance, and good chemical stability of the gold layer.
Product characteristics
1. High purity: Metal thin films have high purity and can provide stable conductivity and excellent conductivity performance.
2. High adhesion: The metal film has good adhesion with the PI substrate and is not easily peeled off or detached.
3. Good corrosion resistance: Metal thin films have excellent oxidation resistance and chemical corrosion resistance, which can protect the substrate from external environmental erosion.
4. Good optical performance: Metal thin films have high reflectivity and transmittance, which can meet the optical needs of different application scenarios.
5. Film uniformity: PI gold-plated film has good film uniformity and can form a uniform metal film on the entire substrate surface.
Production process
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Raw material preparation: Select suitable polyimide raw materials and ensure the purity and quality of the raw materials.
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Melt polymerization: Conduct a melt polymerization reaction at appropriate temperature and pressure to fully melt the raw materials and form a PI film.
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Casting molding: The melted PI film is cast into the desired thickness and width using a casting machine.
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Gold plating treatment: Gold plating treatment is carried out on the surface of PI film to form a uniform metal layer. The gold plating methods include magnetron sputtering, water plating, and magnetron followed by water plating process, each of which has its unique advantages and applicable scope
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