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Gold powder
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Gold powder

Highly dispersed ultrafine gold powder is a special material with extremely high surface area and excellent physical and chemical properties. It is composed of extremely small gold particles, typically less than 100 nanometers in size, which gives gold powder high reactivity and catalytic activity. Due to its unique microstructure and high surface energy, ultrafine gold powder exhibits excellent electrical and thermal conductivity, which makes it widely used in multiple fields.

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Highly dispersed ultrafine gold powder is a metal powder with extremely high surface area and excellent physical and chemical properties. Due to its small particle size, typically between 1 and 100 nanometers, it has a large specific surface area, which gives it many unique properties and a wide range of applications.

Product Features:

  1. High reactivity and catalytic activity: Due to its large specific surface area, highly dispersed ultrafine gold powder has higher activity in chemical reactions and can be used as an efficient catalyst in fields such as chemical synthesis, environmental protection, and energy conversion.

  2. Excellent electrical and thermal conductivity: Ultra fine gold powder has excellent electrical and thermal conductivity due to its fine particle size and high purity, which makes it important for applications in the electronics industry, such as producing high-performance electronic components, heat dissipation materials, etc.

  3. High chemical and thermal stability: Even in high temperature and strong acid-base environments, this gold powder can maintain stable chemical and thermal stability, making it suitable for use under harsh conditions.


Product Model: Highly Dispersed Ultra fine Gold Powder YB-W100
Product Introduction: Micro or sub micron spherical gold powder with uniform particle size, high sphericity, excellent dispersibility, and high tap density, suitable for high-performance gold powder conductive paste, and can be used as thick film conductor material for IC manufacturing, flat displays, printed circuit boards, and solar cells.

Application recommendation: Mainly used in microelectronic materials as the main raw material for gold conductor paste

Technical indicators:

Loose density: 5.0~7.0 g/cm3

Compaction density: 6.0~8.0 g/cm3

Average particle size: ≤ 0.70 μm

Specific surface area: 0.5~2.0 m2/g

Purity: ≥ Au 99.95% (spectral analysis)

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