3W1K adhesive thermal conductive absorbing composite material is a multifunctional composite material designed specifically to solve thermal management and electromagnetic interference (EMI) problems in electronic devices. The characteristic of this material is the combination of high thermal conductivity and electromagnetic wave absorption ability, which can simultaneously achieve the functions of thermal conduction and electromagnetic wave absorption in a single material.
Characteristics and advantages
3W1K adhesive thermal conductive absorbing composite material has the following characteristics and advantages:
- High thermal conductivity: The thermal conductivity of the material is usually greater than or equal to 3 W/m · K, which can effectively conduct heat away from the heat source.
- Absorption performance: The material is capable of absorbing electromagnetic waves within a specific frequency range, reducing electromagnetic interference (EMI).
- Machinability: The material is in the form of paste or semi-solid and can be easily applied to designated areas through methods such as dispensing and coating.
- Reliability: Able to maintain stable performance under different environmental conditions, suitable for various working environments.
- Multifunctionality: It integrates dual functions of thermal conductivity and absorption, reducing the amount of materials required in electronic devices and simplifying the design and assembly process.
composition and structure
This type of material typically consists of the following components:
- Matrix material: As a supporting structure, it can be silicone, epoxy resin, or other polymers, providing the fundamental properties of the material.
- Thermal conductive fillers: fillers used to enhance thermal conductivity, such as aluminum oxide (Al ₂ O3), boron nitride (BN), silver powder (Ag), etc., which can significantly improve the thermal conductivity of materials.
- Absorbing fillers: fillers used to enhance electromagnetic wave absorption performance, such as carbonyl iron, ferrite, carbon nanotubes (CNT), etc. These fillers can absorb electromagnetic waves within a specific frequency range.
- Adhesive: Used to tightly bond the above components together, provide adhesive properties of the material, and ensure the stability of the material during application.
Preparation Method
3W1K adhesive thermal conductive absorbing composite material can be prepared by the following methods:
- Mixing and stirring: Mix the thermal conductive filler and absorbing filler evenly with the matrix material, and stir with a mixer until the desired state is achieved.
- Coating curing: Coating the mixed material onto the desired surface and curing it through natural drying or heating to form the final composite material.
- Glue dispensing technology: using automatic or manual glue dispensing equipment to accurately apply materials to designated locations.
Application scenarios
3W1K adhesive thermal conductive absorbing composite material is widely used in electronic devices that need to simultaneously solve heat management and electromagnetic interference problems, including but not limited to:
- Communication equipment: Reduce EMI and improve signal quality in devices such as base stations and routers.
- Computer hardware: It can conduct heat and absorb waves around heating devices such as CPUs and GPUs.
- Automotive electronics: Reduce EMI and improve reliability in battery management systems, in car entertainment systems, and other parts of electric vehicles.
- Aerospace: Reduce electromagnetic reflection and improve electromagnetic compatibility in aircraft, satellites, and other equipment.
- Medical equipment: Reduce the impact of electromagnetic noise on sensitive medical equipment.
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