Copper foil nickel plating

Copper foil nickel plating is a composite material that deposits a layer of nickel metal on the surface of copper foil through electroplating or chemical plating processes. This treatment not only retains the excellent conductivity of copper foil, but also significantly improves its corrosion resistance and wear resistance, thereby expanding the application fields of copper foil.

Product characteristics

1. Excellent conductivity: Copper foil itself is an excellent conductive material, and its conductivity is further maintained after nickel plating, making it suitable for various occasions that require high conductivity.

2. Excellent corrosion resistance: Nickel coating has good chemical stability, which can effectively block the contact of oxygen and moisture, greatly slowing down the oxidation rate of copper foil and extending its service life.

3. Good machinability and formability: After nickel plating on copper foil, its surface becomes smoother and more delicate, which is beneficial for subsequent mechanical processing and forming treatment.

4. High hardness and wear resistance: The nickel coating significantly increases the surface hardness of copper foil, making it have better wear resistance and able to maintain stable performance in harsh working environments.

5. Aesthetics: The nickel plated copper foil has a smooth and shiny surface, with good decorative effects, suitable for occasions that require an attractive appearance.

Production process

1. Copper foil preparation: Select appropriate copper foil as the substrate and perform necessary cleaning and pretreatment to remove surface impurities such as oil stains and oxides.

2. Pre plating treatment: Activating and catalyzing the copper foil to form a catalyst with chemical reactivity on its surface, providing favorable conditions for the subsequent nickel plating process.

3. Nickel plating: A uniform and dense nickel coating is deposited on the surface of copper foil using electroplating or chemical plating methods. Electroplating methods usually include direct current electroplating, pulse electroplating, etc; Chemical plating forms a nickel layer on the surface of copper foil through chemical reactions.

4. Post treatment: Clean and dry the nickel plated copper foil to remove residual chemical reagents and moisture, and perform necessary surface treatment to improve its performance.

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