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先进院（深圳）科技有限公司

Hotline:0755-22277778 Tel：0755-22277778 
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Company news

2024-11-16Exploration into the Printability and Applicability of Platinum Printing Paste
2024-11-14Analysis of Thermal Stability and Maximum Temperature Endurance of Silver Plated Conductive Cloth
2024-11-13Absorption efficiency and frequency band of carbon nanotube absorbing materials
2024-11-12Application of Tin Plated Copper Foil Tape in Preventing Electromagnetic Wave Interference and Static Electricity Accumulation
2024-11-11Reliability Study of Solderable Conductive Copper Paste in Integrated Circuit Packaging
2024-11-09The relationship between the conductivity of PI nickel plated copper plated film and the nickel and copper layers
2024-11-08How to achieve efficient absorption of microwaves with different polarization modes using microwave absorbing materials
2024-11-07The shielding effect of all-round conductive foam in smart products
2024-11-05Technical article on high temperature resistance testing of aluminum coated PI film
2024-11-04Correlation analysis between the absorption performance of graphene absorbing materials and the content and number of graphene layers
2024-11-02Application and Performance of PI Silver Plated Film as Electrode Material in High end Capacitors
2024-10-29Changes in the conductivity of conductive foam after long-term use and preventive measures
2024-10-28Comparison of conductivity between PI copper plated film and ordinary copper foil: technical advantages and data analysis
2024-10-26Evaluation of Electromagnetic Shielding Efficiency of Nickel Plating Film in Communication Equipment
2024-10-25Temperature resistance range of LED conductive silver adhesive and its adaptability in high-temperature working environment
2024-10-24Analysis of the main materials and structure of copper foil tape
2024-10-12The influence of formulation composition of low-temperature curing silver adhesive on its curing temperature range
2024-10-07Is conductive silver adhesive suitable for all metal surfaces?
2024-10-06Research on the Main Components and Optimal Proportions of Platinum Conductor Slurry
2024-10-06Study on the Radiation Resistance of PI Silver Plated Film in Radiation Environment
2024-09-28Study on post-treatment of PET film after nickel plating to enhance its performance
2024-09-28Notes on the use of ruthenium dioxide in the production of chip resistor paste
2024-09-27Application of PI silver plated film in the field of flexible electronics: achieving thinner, more durable device design
2024-09-26Method for determining the curing or sintering temperature and time of platinum conductor paste
2024-09-25Study on the influence of precise control of temperature, pH value, and current density of copper plating solution on the quality of coating
2024-09-24Analysis of the Effect of Silver Palladium Ratio on Conductivity in Silver Palladium Conductor Slurry
2024-09-24Study on the Compatibility of YB6016 Low Temperature Curing Silver Adhesive with Research Platinum Brand on Different Substrates
2024-09-21Exploration of Compatibility between PI Tin Plating Film and Other Coatings (Gold Plating Film, Silver Plating Film, etc.)
2024-09-21Differences in the Performance of PI Gold Plating Films under Different Gold Plating Processes
2024-09-19Discussion on the Main Components and Optimal Proportioning Technology of Platinum Conductor Slurry
Coating on flexible substrates
Precious metal slurry
Shielding materials
Absorbing material
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