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先进院(深圳)科技有限公司

Hotline:0755-22277778 Tel:0755-22277778 
Mobile:13826586185(Mr.Duan)
Fax:0755-22277776
E-mail:duanlian@xianjinyuan.cn

Company news

2023-02-28Advanced Institute (Shenzhen) Technology Co., Ltd
2025-04-19New Era of Environmental Protection: Exploring the Green Revolution of Advanced Institute's Environmentally Friendly Pressure Free Sintering Silver Paste
2025-04-19Environmentally friendly pressureless sintered silver paste
2025-04-19Fine grained pressureless sintered silver paste: a new era of electronic packaging led by technology
2025-04-19Fine grained pressureless sintered silver paste: a new era of electronic packaging led by technology
2025-04-19Fine grained pressureless sintered silver paste
2025-04-19High reliability pressureless sintered silver paste: reshaping the new era of electronic packaging
2025-04-19High reliability pressureless sintered silver paste: advanced technology leads the new era of electronic packaging
2025-04-19High conductivity pressureless sintered silver paste: a new era of technological reshaping of electronic interconnection
2025-04-19High conductivity pressureless sintered silver paste
2025-04-19Non silicon thermal conductive potting adhesive for high-power LEDs: the light of technology, illuminating the path of the future
2025-04-19TV high voltage cap non silicone sealant: innovative technology, guarding the mystery of every light and shadow
2025-04-19Non silicon thermal conductive sealant for sensors: revolutionizing technology and reshaping the future industrial thermal management landscape
2025-04-19Non silicon thermal conductive sealant for sensors
2025-04-19Silicone free and non silicon thermal conductive sealant: a new material revolution led by technology
2025-04-19Silicone free non silicone thermal conductive sealant
2025-04-18Environmentally friendly non silicon thermal conductive sealant
2025-04-18New Era of LED Heat Dissipation: Innovative Breakthrough of Non Silicon Encapsulation Adhesive
2025-04-18New Era of LED Heat Dissipation: Exploring the Innovative Path of Non Silicon Encapsulation Adhesive
2025-04-18High temperature resistant non silicon thermal conductive sealant: an innovative chapter in reshaping industrial thermal management
2025-04-18Exploring a new technological chapter in high-temperature resistant non silicon thermal conductive potting adhesive
2025-04-18LCP film gold plating process: reshaping the brilliant pearl of the future electronic field
2025-04-18LCP Thin Film Gold Plating Process: An Innovative Work of Advanced Institute Technology
2025-04-18Copper foil gold-plated sheet: a new era for mobile phone antenna modules - exploring the secrets of efficient signal reception and transmission
2025-04-18Technological leap: Copper foil gold-plated sheet leads the signal revolution of mobile phone antenna modules
2025-04-18Copper foil gold plating for high-frequency communication equipment: a precise dance of technology and aesthetics
2025-04-18Copper foil gold plating for high-frequency communication equipment
2025-04-17PPS Gold Plating Film: The Golden Revolution under the Light of Technology
2025-04-17PPS Gold Plating Film: An Innovative Process Journey Led by Advanced Institute Technology
2025-04-17PP gold-plated components with their unique design concepts and innovative technological applications
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