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先进院(深圳)科技有限公司

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E-mail:duanlian@xianjinyuan.cn

Precious metal paste

2025-04-08Silver Platinum Light: Unlocking a New Realm of Excellent Conductivity
2025-02-24Analysis of the difficulties in the application of silver palladium paste in filter circuits in thick film hybrid integrated circuits
2025-02-24Technical exploration on enhancing the adhesion of platinum conductor paste after solidification or sintering
2025-02-20Technical exploration of improving the electronic transmission efficiency limit of gold conductor paste
2025-02-20Addressing the issue of incomplete penetration during welding of weldable gold platinum palladium paste
2025-02-17What are the key factors in the high conductivity design of low-temperature conductive silver paste
2025-02-17Improve the antioxidant performance of conductive silver paste in integrated circuits
2025-02-13Strategies for improving the antioxidant properties of silver palladium powder
2025-02-13How to optimize the cell voltage and current density when electrolyzing palladium powder
2025-02-10Chemical stability analysis of bismuth ruthenate powder
2025-02-10Crystal control technology of ruthenium dioxide in the preparation process
2025-02-10Preparation method of chip resistor paste: strategy for achieving low resistance and high compatibility
2025-02-06The relationship between the mechanical strength of the cured layer and the additives in the solderable conductive copper paste
2025-02-06Solving the agglomeration problem of pressureless sintered nano copper paste during storage
2025-01-20Technical exploration on avoiding agglomeration of nanoscale platinum particles in the preparation process of platinum electrode slurry
2025-01-20How to control the drying speed of printing platinum paste: avoid performance problems caused by too fast or too slow
2025-01-16Application of surface welding gold paste technology to enhance the reliability and stability of electrical connections in automotive electronic systems
2025-01-16The specific application and advantages of printing gold paste in circuit board production
2025-01-13How does the curing time of low-temperature conductive silver paste affect its conductivity
2025-01-13How to ensure good conductivity of touch screen conductive silver adhesive at low resistivity
2025-01-09Analysis of the role and dosage of additives in the production of nano conductive silver paste
2025-01-09Exploration into the Printing Accuracy of High Temperature Conductive Silver Paste and Its Meeting of Micro Circuit Requirements
2025-01-06Discussion on viscosity control technology of LTCC through-hole gold paste
2025-01-06Optimization strategy for leveling and printability of platinum conductor paste
2025-01-02The variation law of conductivity of printed silver paste at different temperatures
2024-12-31Corrosion resistance enhancement strategy of silver platinum electrode paste in electrochemical environment
2024-12-30Technical exploration on solving the problem of detachment of platinum electrode slurry after solidification and sintering
2024-12-27Analysis of Hardness, Toughness, and Plasticity of Surface Welding Gold Paste and Its Application Requirements
2024-12-26The relationship between the mechanical properties, product characteristics, and silver particle content and distribution of nano conductive silver paste
2024-12-25Design and Optimization of Conductive Silver Adhesive Conductive Pathways in Integrated Circuits
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