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先进院（深圳）科技有限公司

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Precious metal paste

2024-12-26The relationship between the mechanical properties, product characteristics, and silver particle content and distribution of nano conductive silver paste
2024-12-25Design and Optimization of Conductive Silver Adhesive Conductive Pathways in Integrated Circuits
2024-12-24Control strategy for the discreteness of resistance value of oil level sensor resistor slurry
2024-12-23The relationship between mechanical strength of sintered layer and additives in low-temperature sintered copper paste
2024-12-20Exploration into the Relationship between the Hardness of Printing Silver Paste and the Wear Resistance of Printing Layers
2024-12-19How to control the shrinkage rate of platinum electrode slurry during solidification or sintering process
2024-12-19The influence mechanism of catalytic activity of co fired platinum electrode slurry on electrochemical reactions
2024-12-18How to optimize the density and specific heat capacity of surface bonding alloy slurry to enhance the reliability of electronic devices
2024-12-17Analysis of technical reasons for insufficient strength of pressure sintered silver paste connection layer
2024-12-12Application prospects and challenges of nano conductive silver paste in biomedical electrodes
2024-12-11Application of Co fired Platinum Electrode Slurry in Co fired Biosensor Electrodes
2024-12-07Analysis of anti-aging property of high-temperature conductive silver adhesive
2024-12-07Analysis of the service life of low-temperature conductive silver paste in electronic devices
2024-12-03How stable is antioxidant conductive copper paste at high temperatures
2024-11-28Requirements for heat resistance performance of resistance paste for heating element
2024-11-22Improvement technology of conductivity of nano copper paste in thin film circuits
2024-11-22Discussion on the Printing Performance and Applicability of Copper Paste for PCB Circuit Board Printing
2024-11-21Continuous research and innovation direction of low-temperature conductive silver paste: exploration to enhance competitiveness
2024-11-16Exploration into the Printability and Applicability of Platinum Printing Paste
2024-11-11Reliability Study of Solderable Conductive Copper Paste in Integrated Circuit Packaging
2024-10-25Temperature resistance range of LED conductive silver adhesive and its adaptability in high-temperature working environment
2024-10-12The influence of formulation composition of low-temperature curing silver adhesive on its curing temperature range
2024-10-07Is conductive silver adhesive suitable for all metal surfaces?
2024-10-06Research on the Main Components and Optimal Proportions of Platinum Conductor Slurry
2024-09-28Notes on the use of ruthenium dioxide in the production of chip resistor paste
2024-09-26Method for determining the curing or sintering temperature and time of platinum conductor paste
2024-09-24Analysis of the Effect of Silver Palladium Ratio on Conductivity in Silver Palladium Conductor Slurry
2024-09-24Study on the Compatibility of YB6016 Low Temperature Curing Silver Adhesive with Research Platinum Brand on Different Substrates
2024-09-19Discussion on the Main Components and Optimal Proportioning Technology of Platinum Conductor Slurry
2024-09-19The conductivity of conductive silver paste and its performance in high-precision electronic applications
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