Nickel plated copper foil tape

Nickel plated copper foil tape is based on copper foil, coated with a nickel layer on the surface of the copper foil, and usually has an adhesive layer. Copper foil provides excellent conductivity and other basic properties, while nickel plating supplements and enhances some of its properties. The adhesive layer is used for bonding and fixation, making it convenient for use in electronic products and other devices.

Performance characteristics

1. Electromagnetic shielding performance
   • Due to the excellent conductivity of copper foil itself, nickel plating further enhances its shielding ability against electromagnetic signals. In electronic products, it can effectively prevent external electromagnetic interference from entering the device's interior, while also preventing electromagnetic signals from leaking out, thereby ensuring the normal operation of the device and the security of data.
2. chemical stability
   • The presence of nickel layer improves the chemical stability of copper foil. Compared to simple copper foil, nickel plated copper foil tape is less prone to corrosion in some complex chemical environments, which allows it to maintain good performance in different usage environments.

3. Good conductivity

   • The conductivity of copper foil is an important characteristic, and nickel plating does not significantly reduce its conductivity, so it can play a good role in circuits or equipment that require both conductive connections and electromagnetic shielding.
     

   
   

Production process

1. Pre treatment before electroplating: Before electroplating, copper foil needs to undergo a series of pre-treatment steps to ensure a clean surface, free of grease, oxides, and other impurities, in order to obtain good coating adhesion.

2. Electroplated nickel plating: Place the pre treated copper foil into an electroplating solution containing nickel salts, and deposit a layer of nickel on the surface of the copper foil by electrolysis. This process requires controlling parameters such as current density, temperature, pH value, etc. to ensure that the nickel layer is uniform, dense, and has good adhesion.

3. Post electroplating treatment: After electroplating is completed, the copper foil needs to be cleaned and dried to remove residual chemical substances on the surface and ensure that the nickel layer is not contaminated.

4. Glue coating: Apply a layer of adhesive on the nickel layer, and the choice of adhesive depends on the final application requirements, such as temperature, humidity, chemical resistance, etc.

5. Composite: Composite nickel plated copper foil coated with adhesive with carrier tape to form nickel plated copper foil tape.

application area

1. electronic product
   • Used to shield electromagnetic interference in devices such as mobile phones, tablets, and laptops. For example, sticking nickel plated copper foil tape around the circuit board inside a mobile phone can prevent electromagnetic interference between different circuit modules, improve the phone's signal reception and processing capabilities, and also reduce the phone's electromagnetic interference with other devices.
2. communication devices
   • Such as base station equipment, communication switches, etc. These devices have high requirements for electromagnetic compatibility, and nickel plated copper foil tape can effectively shield external interference signals, ensuring the stability and reliability of communication.