The solution strategy for the brittleness problem of gold-plated copper foil coating

Gold-plated copper foilIt has a wide range of applications in various fields such as electronics and communication, but the brittleness of the coating has always been a key issue restricting its performance improvement. This not only affects the reliability and service life of the product, but may also lead to an increase in the scrap rate during the production process. Advanced Institute (Shenzhen) Technology Co., Ltd. has made significant progress in overcoming this challenge with its professional research team and advanced technological equipment.

The main salt concentration, type and content of chelating agents in the plating solution have a significant impact on the quality of the coating. If the concentration of the main salt is too high or the proportion of chelating agents is inappropriate, it will cause uneven crystallization of the coating, generate significant internal stress, and increase brittleness. In addition, impurities such as metal ions (iron, copper, etc.) and organic impurities in the plating solution can be mixed in the coating, damaging the crystal structure integrity of the coating and making it brittle.

Excessive current density is one of the common reasons for the brittleness of coatings. Excessive current density can cause rapid deposition of gold ions on the cathode, leading to rapid growth of the coating, formation of coarse grains and loose structures, increased internal stress, and increased brittleness of the coating. Meanwhile, poor control of parameters such as electroplating temperature and pH value can also affect the microstructure and properties of the coating, thereby increasing its brittleness.

The roughness, oil stains, and residual oxides on the surface of copper foil can affect the adhesion between the coating and copper foil, as well as the growth morphology of the coating. Excessive roughness or incomplete pretreatment can lead to stress concentration in the coating during growth, making it prone to cracking and exhibiting brittle characteristics.

Through extensive experiments and microscopic analysis, Advanced Institute (Shenzhen) Technology Co., LtdWe have developed a new plating solution formula. Accurately adjust the ratio of the main salt to the chelating agent to ensure the optimal state, ensuring uniform and fine crystallization of the coating. At the same time, advanced impurity removal technologies such as ion exchange resins and precision filtration systems are used to effectively remove various impurities from the plating solution, reducing the factors that cause brittle coating from the source.

The intelligent electroplating control system independently developed by the company is capable of real-time monitoring and precise regulation of electroplating process parameters. Automatically adjust the current density based on the growth of the coating to avoid excessive or insufficient current density, ensuring that the coating grows uniformly at an appropriate rate. In addition, precise control of temperature and pH values is also carried out to maintain the stability of the plating solution and the good performance of the coating, effectively reducing the internal stress and brittleness of the coating.

We have developed advanced copper foil surface treatment technology, which first uses fine grinding and polishing techniques to control the surface roughness of the copper foil within a very small range, providing a smooth and uniform growth foundation for the coating. Then, using environmentally friendly cleaning agents and electrochemical cleaning methods, thoroughly remove the oil and oxide on the surface of the copper foil, enhance the adhesion between the coating and the copper foil, reduce stress concentration during the coating growth process, and improve the toughness of the coating.

Through in-depth research and technological innovation in plating solution formula, electroplating process, and copper foil surface pretreatment, Advanced Institute (Shenzhen) Technology Co., Ltd. has successfully solved the problem Gold-plated copper foilThe problem of high brittleness of the coating. These technological achievements not only improve the product quality and performance of gold-plated copper foil, but also provide strong support for the development of related industries. With the continuous advancement and application promotion of technology, it is believed that gold-plated copper foil will play its advantages in more fields and make greater contributions to the development of the electronic information industry. At the same time, the company will continue to devote itself to the research and development of material surface treatment technology, constantly exploring and solving more technical problems in practical production, and promoting the continuous improvement of the industry's technological level.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.