How to control the surface roughness of high sintered copper paste used in MLCC to enhance its conductivity?

With the rapid development of modern electronic technology, multilayer ceramic capacitors (MLCC) have been widely used in various electronic devices due to their high capacity, high-frequency characteristics, wide operating temperature range, and small size. However, the performance of MLCC largely depends on the properties of its internal materials, especially the conductivity and surface roughness of high sintered copper paste. This article will explore how to controlMLCC uses high fever copper pasteThe surface roughness is used to enhance its conductivity.

Composition and Function of High Temperature Copper Paste for MLCC

High fever and copper paste formationMainly composed of copper powder, glass powder, organic carrier, and additives. Copper powder and glass powder are responsible for providing conductivity and structural strength after sintering, while organic carriers play a role in dispersing, wetting, and carrying other components, and additives are used to adjust the physical and chemical properties of the slurry to meet specific process requirements.

1. Copper powder: Provides conductivity.
2. Glass powder: Provides structural strength during sintering and helps form good connections between copper powders.
3. Organic carrier: mainly composed of resin and organic solvent, it plays a role in dispersing, wetting, and carrying solid particles.
4. Additive: Adjust the physical and chemical properties of the slurry.

Strategies for controlling surface roughness

1. Optimize the proportion of organic carriers

   The proportion of organic carriers has a significant impact on the dispersibility, wettability, and viscosity of the slurry. By optimizing the proportion of organic carriers, the dispersion uniformity of copper powder and glass powder in the slurry can be improved, the agglomeration phenomenon can be reduced, and the surface roughness of the sintered body can be improved.

   Advanced Institute (Shenzhen) Technology Co., LtdThrough multiple experiments and optimizations, the optimal proportion of organic carriers in the high-temperature sintered copper paste for YB5112 MLCC under the research platinum brand has been determined to be 25%. At this ratio, the slurry has good fluidity, and copper powder and glass powder are evenly dispersed in the slurry, improving the uniformity and density of the sintered body.

2. Using high-quality raw materials

   High quality copper powder and glass powder can ensure good connections during sintering, reduce the formation of pores and cracks, and thus lower surface roughness.

3. Improve sintering process

   The sintering process has a significant impact on the conductivity and surface roughness of MLCC. By optimizing parameters such as sintering temperature, sintering time, and atmosphere, the surface roughness of the sintered body can be further reduced and the conductivity can be improved.

Experimental results and analysis

In order to verify the effectiveness of the above strategy, Advanced Institute (Shenzhen) Technology Co., LtdResearch Platinum YB5112 MLCC High Temperature Copper PasteA series of experiments were conducted.

1. Viscosity test: By measuring the viscosity of the slurry under different organic carrier ratios, it was found that when the organic carrier ratio is 25%, the viscosity of the slurry is moderate, which is conducive to coating and not easy to flow.

2. Dispersion test: Observing the dispersion of copper powder and glass powder in the slurry, it was found that when the proportion of organic carrier was 25%, the dispersion effect of copper powder and glass powder was better without agglomeration.

3. Sintering performance test: The density and conductivity of the sintered body were tested at different sintering temperatures. It was found that when the proportion of organic carrier was 25%, the density and conductivity of the sintered body were higher, and the sintering temperature was relatively lower, saving energy.

conclusion

By optimizing the proportion of organic carriers, using high-quality raw materials, and improving sintering processes, the surface roughness of high sintered copper paste used in MLCC can be effectively controlled, enhancing its conductivity. The YB5112 MLCC high-temperature sintered copper paste developed by Advanced Institute (Shenzhen) Technology Co., Ltd. has achieved this goal through multiple experiments and optimizations, providing higher quality material support for the manufacturing of electronic components. In the future, with the continuous development of electronic technology, we will continue to explore and optimize the formula and preparation process of high sintering copper paste to meet the needs of higher performance MLCC.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.