Electrolytic copper foil nickel plating: reduced chemical corrosiveness and side corrosion phenomenon

Electrolytic copper foil nickel platingIt is a common surface treatment technique widely used in fields such as electronics, electrical manufacturing, aerospace, etc. Its main function is to improve the corrosion resistance of copper foil and reduce side corrosion during the etching process. This article will explore the importance of nickel plating on electrolytic copper foil from multiple dimensions and its role in reducing side corrosion phenomenon.

1、 Chemical corrosiveness of nickel plating on electrolytic copper foil

1. Introduction to Nickel Plating Process

Electrolytic nickel plating on copper foil is a process of forming a nickel metal protective film on the surface of the copper foil through electrochemical methods. Nickel has good corrosion resistance and can effectively prevent copper foil from being corroded by chemical substances such as oxidation, acid and alkali in the environment.

2. Analysis of experimental data

Experimental studies were conducted on the nickel plating process of electrolytic copper foil, and the results showed that the copper foil treated with nickel plating had significantly improved corrosion resistance in common chemical environments. For example, suspending nickel plated and untreated copper foil separately in an acidic solution showed significant corrosion on the surface of the untreated copper foil, while the surface of the copper foil treated with nickel plating had almost no corrosion marks.

3. Explanation of application cases

The application range of electrolytic copper foil nickel plating process is wide, and the electronic packaging industry is one of its important fields. When manufacturing electronic substrates, using electroplated copper foil can improve the chemical corrosion resistance of the substrate and prevent it from being corroded in acidic media. This significantly improves the reliability and service life of electronic devices.

2、 The reduction effect of nickel plating on etching side corrosion of electrolytic copper foil

1. Explanation of lateral erosion phenomenon

Etching is a common surface processing method used to remove unwanted substances from the substrate surface. However, during the etching process, side etching often occurs, where the etched material diffuses towards the side of the substrate, resulting in a decrease in the quality of the processed product.

2. The effect of nickel plating on side corrosion of electrolytic copper foil

After electrolytic copper foil nickel plating treatment, a uniform protective film is formed on the nickel plating layer, which can effectively prevent the etching agent from corroding the copper foil. Experimental data shows that the copper foil treated with nickel plating significantly reduces the phenomenon of side corrosion during the etching process. For example, etching tests were conducted on copper foil treated with nickel plating and untreated copper foil, and the results showed that untreated copper foil had significant side corrosion on the side, while copper foil treated with nickel plating only had surface etching and almost no side corrosion phenomenon.

3. Explanation of application cases

　　Electrolytic copper foil nickel platingThe characteristic of reducing lateral erosion makes it widely applicable in the electronic manufacturing industry. For example, in the manufacturing process of printed circuit boards, the use of electrolytic copper foil nickel plating technology can reduce quality problems such as line width narrowing caused by side etching during the etching process, thereby improving the manufacturing quality of printed circuit boards.

Conclusion: Electrolytic nickel plating on copper foil is a surface treatment technique that can improve the corrosion resistance of copper foil and reduce side corrosion during the etching process. Through the analysis of its chemical corrosiveness and its ability to reduce lateral corrosion, it can be seen that this technology has important application prospects in fields such as electronics, electrical manufacturing, and aerospace.