Hotline:0755-22277778
Tel:0755-22277778
Mobile:13826586185(Mr.Duan)
Fax:0755-22277776
E-mail:duanlian@xianjinyuan.cn
Introduction:Metal coated silicon waferAs a common process, its preparation involves multiple process and material choices. Based on processes such as magnetron sputtering, thermal evaporation, and electroplating, this article will discuss the preparation and application fields of metal film silicon wafers, focusing on substrate materials, types of metal films, and metal film thickness.
1、 Magnetron Sputtering: Creating Radiant Miracles
Magnetron sputtering is a widely used process in the preparation of metal coated silicon wafers. It uses a magnetic field to control ion bombardment of metal targets in a vacuum environment, causing them to evaporate and deposit on substrates such as silicon wafers. This process can prepare uniform, dense, and well adhered metal films. Moreover, magnetron sputtering can also adjust the lattice structure and microstructure of the coating to a certain extent.
2、 Thermal evaporation: lighting up the dreamy radiance
In addition to magnetron sputtering, thermal evaporation is also one of the important processes for preparing metal film silicon wafers. During this process, the metal target material is heated to high temperature, and the metal vapor diffuses and condenses on the surface of the silicon wafer to form a metal layer. Compared with magnetron sputtering, thermal evaporation has the advantages of fast preparation speed and simple operation. However, due to the collision between metal film particles during the evaporation process, the grain size of the metal film obtained by thermal evaporation is usually larger and the surface roughness is higher.
3、 Electroplating: casting brilliant light
Electroplating, as a common technique in the preparation of metal film silicon wafers, is widely used in decoration, protection, and enhancing conductivity. It is achieved by immersing the substrate surface in an electrolyte solution containing metal ions, applying an electric current, and reducing the metal ions to deposit on the substrate. By electroplating, metal films with good appearance and uniform thickness can be prepared. In addition,Electroplating filmThe thickness can be adjusted by controlling the concentration of metal salts and current density in the plating solution.
4、 Selection of Base Materials: Creating a Stable and Sturdy Foundation Stone
In the preparation of metal film silicon wafers, materials such as silicon wafers, quartz, BF33 glass, etc. are often used as substrate materials. Silicon wafers, as the most common substrate material, are widely used in fields such as integrated circuits and optical devices due to their excellent hardness, thermal stability, and electrical properties. Quartz and BF33 glass are widely used in optical coatings due to their excellent optical properties.
5、 Types and thicknesses of metal films: showcasing various charms
There are various types of metal films, such as gold Au, platinum Pt, aluminum Al, copper Cu, nickel Ni, silver Ag, etc. Each metal film has its unique physical and chemical properties and application fields. In addition, the thickness of the metal film is also an important factor to consider during the preparation process. According to different application requirements, the thickness of metal films can be selected between 10nm-10um, with thicknesses such as 100nm, 300nm, and 500nm widely used in fields such as electronics, optics, and materials science.
Summary:Metal film silicon waferPreparation is a technically complex and important process, and magnetron sputtering, thermal evaporation, and electroplating are commonly used preparation methods. Choosing appropriate substrate materials, types and thicknesses of metal films not only enables the preparation of high-quality metal film silicon wafers, but also provides broad space for applications in different fields. By fully understanding and optimizing metal film silicon wafers, we can continuously drive innovation in fields such as technology, engineering, and manufacturing, creating a better future.
Advanced Institute (Shenzhen) Technology Co., Ltd, © two thousand and twenty-onewww.avanzado.cn. All rights reservedGuangdong ICP No. 2021051947-1 © two thousand and twenty-onewww.xianjinyuan.cn. All rights reservedGuangdong ICP No. 2021051947-2