Electrolytic copper foil nickel plating: improving chemical corrosion resistance and reducing side corrosion phenomenon

Introduction: In the electronics industry,cclPlaying a crucial role. However, due to the influence of the environment and chemical substances, the corrosion resistance and etching issues during the production process of copper-clad laminates have become urgent problems for manufacturers to solve. Fortunately, by using electrolytic copper foil coated with a layer of nickel, not only can the chemical corrosion resistance be improved, but also the lateral corrosion phenomenon during etching can be significantly reduced.

1、 Chemical corrosion resistance of electrolytic copper foil

Copper clad laminates are composed of copper foil and substrate, and their chemical corrosion resistance to a certain extent determines their service life and performance. In the past, the surface of copper foil was prone to oxidation, resulting in the formation of copper oxides or reactions between copper substrates and chemical substances, causing the copper clad laminate to lose its original conductivity, thermal conductivity, and mechanical properties. However, by electrolyzing copper foil with nickel plating, a nickel layer can be formed on the surface of the copper foil, thereby enhancing its chemical corrosion resistance.

Nickel layer, as a material with good corrosion resistance, can effectively prevent the copper foil surface from reacting with substances such as oxygen, moisture, acid and alkali in the environment. At the same time, the nickel layer can also increase the oxidation resistance of copper-clad laminates and improve their high temperature resistance. Therefore, electrolytic copper foil nickel plating has become an effective method to improve the chemical corrosion resistance of copper-clad laminates.

2、 Effective measures to reduce lateral erosion phenomenon

When making copper-clad laminates, etching steps are often required to remove unwanted copper foil areas. However, traditional manufacturing methods suffer from lateral corrosion, which expands the range of copper foil corrosion and makes it difficult to accurately control the precision and shape of etching. This is a serious issue for copper-clad laminates that require high precision in fields such as microelectronics.

However, by electroplating copper foil with nickel, the phenomenon of side corrosion can be significantly reduced. After being coated with a layer of nickel, the lateral corrosion phenomenon of the copper-clad laminate is reduced, the copper foil maintains a better shape, and the etching accuracy is effectively improved. This is due to the physical properties of the nickel layer, which can prevent corrosive agents from penetrating the edges of the copper foil, thereby suppressing the occurrence of side corrosion.

Meanwhile, the method of nickel plating on electrolytic copper foil can be customized as needed to control the thickness of the nickel layer. By optimizing the coating parameters, the best anti-corrosion effect and lateral corrosion control can be achieved, thereby meeting the requirements of different application fields for copper-clad laminates.

3、 Application prospects of nickel plating on electrolytic copper foil

The wide application prospects of electrolytic copper foil nickel plating technology can be described as rich and diverse. In the electronics industry, electrolytic copper foil nickel plating can be used to make high-frequency cables, RFID tags, antennas, etc. Its chemical corrosion resistance and side corrosion control advantages will greatly improve the performance and service life of products.

In addition, high stability and reliability of copper-clad laminates are crucial in military, aerospace, and other fields. The application of electrolytic copper foil nickel plating technology can increase the corrosion resistance of copper-clad laminates, reduce side corrosion, and thus improve product quality and reliability.

Summary:Electrolytic copper foil nickel platingBy improving chemical corrosion resistance and reducing lateral corrosion, it has become an important technology in the field of copper-clad laminate production. After being coated with a layer of nickel, copper-clad laminates can better resist corrosion, extend their service life, and effectively control the lateral corrosion phenomenon during the etching process. The application prospects of electrolytic copper foil nickel plating technology are broad, which will bring more stable and reliable products to the electronics industry, military and aerospace fields.