What effect does the dispersibility of nano copper paste have on its microstructure after pressureless sintering?

Nano copper paste, as a high-performance conductive material, has shown broad application prospects in fields such as microelectronic packaging, flexible electronics, and solar cells. Its dispersibility has a significant impact on the microstructure after pressureless sintering. This article will explore the development of Advanced Institute (Shenzhen) Technology Co., LtdYanbo brand YB5108 pressureless sintered nano copper pasteHow does the dispersibility affect its microstructure after sintering.

1. Basic characteristics of nano copper paste

YB5108 pressureless sintered nano copper paste from Yanbo brandNano sized copper particlesComposed of organic carriers and functional additives. Its high specific surface area and surface activity enable the uniform dispersion of nano copper particles in the slurry, thereby improving the conductivity and sintering effect. Good dispersibility can not only prevent particle agglomeration, but also ensure the formation of a dense conductive network during the sintering process.

2. The influence of dispersibility on microstructure

2.1 Particle uniformity

The dispersibility of nano copper paste directly affects the uniformity of particles. Uniformly dispersed nano copper particles can effectively contact and bond during pressureless sintering, forming a denser microstructure. Experiments have shown that in a well dispersed state, the porosity of the microstructure of YB5108 significantly decreases and its conductivity improves after sintering.

2.2 Sintering temperature and time

Good dispersibilityNano copper pasteEffective sintering can be achieved at lower sintering temperatures and times. Good dispersibility increases the contact area between nanoparticles, promotes atomic diffusion and particle bonding, thereby achieving high-strength interconnect structures under low temperature conditions. This characteristic makes the pressureless sintering process more efficient and reduces energy consumption.

2.3 Stability of microstructure

During the sintering process, poorly dispersed nano copper particles are prone to agglomeration, resulting in uneven microstructure and increased defects. This will affect the conductivity and mechanical strength of the material. Research has shown that YB5108, a platinum brand, exhibits significantly improved microstructural stability after sintering while maintaining good dispersibility, effectively resisting external environmental influences.

3. Conclusion

in summary,Nano copper pasteThe dispersibility of the material has a significant impact on its microstructure after pressureless sintering. Good dispersibility can improve the uniformity of particles, reduce sintering temperature and time, and enhance the stability of microstructure. The YB5108 pressureless sintered nano copper paste from Advanced Institute (Shenzhen) Technology Co., Ltd. has shown excellent performance in these aspects, providing a solid foundation for its application in electronic packaging and other fields.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.