How to ensure product quality in the electroplating process of copper foil gold plating?

In the modern electronics industry, copper foil gold plating technology has attracted much attention due to its excellent conductivity and corrosion resistance. Advanced Institute (Shenzhen) Technology Co., Ltd., as an innovative electromagnetic shielding and thermal conductivity solution service provider at the forefront of technology today, focuses onFlexible substrate coatingResearch and production of precious metal pastes, electromagnetic shielding materials and devices, and absorbing materials. existCopper foil gold platingEnsuring product quality is a crucial step in the electroplating process. The following are key measures to ensure the quality of copper foil gold-plated products:

1. Preparation and maintenance of electroplating solution

Electroplating solution is an important component of the electroplating process, which has a direct impact on the quality of electroplating. Advanced Institute (Shenzhen) Technology Co., Ltd. strictly controls the concentration and stability of metal ions when preparing and maintaining electroplating solutions, regularly checks and adjusts the concentration of various components in the electroplating solution in a timely manner, avoids impurities and pollutants, and maintains the purity of the electroplating solution.

2. Control current density and process parameters

Current density is one of the key factors affecting the quality of coatings.Advanced Institute (Shenzhen) Technology Co., LtdBy adopting an advanced power control system, the current density during the electroplating process is accurately controlled to ensure uniform coating thickness, absence of defects such as bubbles and pinholes, thereby improving the adhesion of the coating.

3. Substrate pretreatment

The impurities such as grease, dirt, and oxides that may exist on the surface of copper foil can seriously affect the adhesion of the coating. Advanced Institute (Shenzhen) Technology Co., Ltd. adopts efficient chemical cleaning and ultrasonic cleaning technology, combined with mechanical polishing, to ensure that the copper foil surface is clean and free of impurities. In addition, the cleaned copper foil needs to undergo activation treatment to increase surface activity and improve the adhesion of the coating.

4. Optimization of plating solution formula

Advanced Institute (Shenzhen) Technology Co., Ltd. has developed a high-performance gold plating solution formula through long-term research and practice. This formula has the advantages of stable process, long tank life, fast deposition speed, and uniform distribution of coating. Specifically, the additive components in the plating solution have been carefully optimized to significantly improve the adhesion between the coating and the substrate.

5. Electroplating process control

The temperature and time during the electroplating process also have a significant impact on the quality of the coating. Advanced Institute (Shenzhen) Technology Co., Ltd. sets appropriate temperature and time parameters based on the characteristics of the plating solution and process requirements. By accurately controlling these parameters, it is ensured that the coating has good uniformity and density, thereby improving the adhesion and overall performance of the coating.

6. Post processing

Gold-plated copper foilIn order to improve the corrosion resistance of the coating, Advanced Institute (Shenzhen) Technology Co., Ltd. uses environmentally friendly passivation solution to treat the gold plating layer, forming a dense protective film. This protective film can not only improve the corrosion resistance of the coating, but also further enhance the adhesion between the coating and the substrate.

The above data is for reference only, and specific performance may vary due to production processes and product specifications.