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Electroless CopperThere are two types of copper: thick copper and ordinary thin copper. The thick copper process usually does not require another copper plating, but directly enters the film coating process, saving time. Thick copper is usually replaced with copper chloride instead of copper sulfate to accelerate deposition rate. Thin copper uses copper sulfate. The complexation system is also different, but considering environmental protection, EDTA should be avoided as much as possible, and a double complexation system is usually used.
characteristic:
Chemical copper plating solution is used for hole metallization of PCB, which can deposit a pink copper layer on the activated non-conductive surface. This solution has good stability and high deposition rate, and the copper layer has the characteristics of fine crystallization and good adhesion.
A plating solution with a formula of 3 g/L copper sulfate, 25 g/L potassium sodium tartrate, 10 g/L formaldehyde (mass fraction of 36% to 40%), and 7 g/L sodium hydroxide was used. The optimal process parameters were determined by investigating the effects of plating temperature, plating solution pH, and plating time on plating rate. The coating was prepared under optimized process conditions, and the morphology and composition of the coating were analyzed using scanning electron microscopy and energy dispersive spectroscopy The results showed that the optimal process was a plating solution temperature of 50 ℃, pH=12, Plating time is 45-50 minutes; The coating prepared using this optimized process condition appears bright and uniform, with good adhesion to the substrate
Chemical Copper Plating on PP PlasticIt is a new type of high-performance composite material, which is made of PP plastic and copper electroplating. It has excellent electrical insulation, heat resistance, corrosion resistance, and arc resistance, and is widely used in the packaging of electronic devices, chip packaging, and sensor manufacturing. The production process of PP plastic chemical copper plating is to first treat the surface of PP plastic, then electroplate it with a layer of copper, and finally perform heat treatment to form the final PP plastic chemical copper plating. PP plastic chemical copper plating has excellent thermal stability, which can effectively resist the effects of high and low temperatures, suppress the deformation and damage of electronic components, and thus improve the reliability of electronic components.
In addition, PP plastic electroless copper plating also has good corrosion resistance, which can effectively prevent corrosion of metal surfaces and significantly improve the service life of electronic components. In addition, PP plastic electroless copper plating also has good conductivity, which can effectively reduce the resistance of electronic components, improve the working efficiency of electronic components, and thus enhance the efficiency of electronic components. In addition, PP plastic electroless copper plating also has good moisture resistance, which can effectively resist the erosion of humid environments and improve the service life of electronic components.
In short, PP plastic chemical copper plating is a very practical technology that can effectively block external electromagnetic waves and resist interference, thereby protecting internal electronic components from external interference. It can also improve the conductivity and moisture resistance of electronic components. Therefore, its application can significantly improve the reliability and stability of electronic components, making it a very practical technology. Therefore, the chemical copper plating technology for PP plastics is expected to have greater development and application in the future.
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