In the PCB manufacturing process, circuit defects are a common problem, and using conductive paste with good plasticity for circuit repair can significantly reduce the scrap rate. Advanced Institute Technology has introduced an advanced technology
Low temperature curing silver adhesiveIt has excellent conductivity and reliable adhesion, which can meet the requirements of fine circuit repair. After curing, it can be polished, repaired, and copper plated for color correction, ultimately bringing a consistent appearance effect.
Silver adhesive with appropriate fineness and moderate viscosity
Advanced Institute Technology's product uses micro nano composite silver powder as the core of low-temperature curing silver adhesive, with a fineness of less than 5 μ m and a viscosity between 90-120 Pa · s. This silver gel has a silver content of 81 ± 1 wt.%, a resistivity of less than 45 μ Ω· cm, and a surface hardness of 4H. Through 3M tape testing, we can verify that it has good adhesion strength.
Strong applicability and good repair effect
Firstly, the silver powder particles of this silver paste are at the sub micron level, making it highly suitable for repairing fine circuits. This means that no matter how minor the damage to the circuit is, the silver adhesive can be repaired with extremely high precision, ensuring that the repaired circuit can conduct electricity normally.
Secondly, the curing temperature of the silver paste is relatively low, only 160 ℃. Compared with other repair materials, it has a smaller thermal impact on PCB boards, thus effectively improving the success rate of repairs.
Finally, the cured silver paste can also be polished and plated with copper to maintain the appearance of the repaired circuit consistent with the original circuit. This feature is very important in maintaining the appearance of PCB boards.
Reduce scrap rate and improve cost-effectiveness
use
Supplementary silver pastePerforming PCB circuit repairs can not only improve the accuracy and reliability of repairs, but more importantly, significantly reduce the scrap rate of PCB manufacturers. Due to process, environmental, and human factors, there are various forms of circuit defects that directly affect the quality of PCB boards. However, when using silver paste for repair, these defects can be effectively corrected, greatly reducing the risk of scrap.
In addition, the price of silver paste for wire repair is relatively low and has similar costs compared to wire bonding methods. Therefore, not only is it better in terms of effectiveness, but from an economic perspective, silver paste for repairing wires is also a wise choice for PCB board manufacturers.
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