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In the rapid development of modern electronic technology, multilayer ceramic capacitors (MLCC) are an important component of electronic components, and their performance and quality directly affect the stability and reliability of the entire electronic system. The optimization of the composition and proportion of high-temperature copper paste, as a key material in the manufacturing process of MLCC, is crucial for improving the performance of MLCC. This article will be developed by Advanced Institute (Shenzhen) Technology Co., LtdResearch Platinum YB5112 MLCC High Temperature Copper PasteFor example, explore how to determine the optimal ratio of organic carriers.
High fever and copper paste formationMainly composed of copper powder, glass powder, organic carrier, and additives. Among them, copper powder and glass powder are responsible for providing conductivity and structural strength after sintering, while organic carriers play a role in dispersing, wetting, and carrying other components. Additives are used to adjust the physical and chemical properties of the slurry to meet specific process requirements.
Organic carriers are mainly composed of resins and organic solvents, which play the following key roles in the slurry:
Determining the optimal proportion of organic carriers requires comprehensive consideration of the physical and chemical properties of the slurry, sintering performance, and production cost. The following is a method based on experimental data:
Advanced Institute (Shenzhen) Technology Co., LtdDeveloped YB5112 MLCC brand for research and developmentHigh fever and copper paste formationAfter multiple experiments and optimizations, the optimal proportion of organic carrier was finally determined to be 25%. The slurry at this ratio has the following advantages:
Through experimental design and data analysis, we have determinedMLCC uses high fever copper pasteThe optimal proportion of organic carriers is 25%. The slurry at this ratio has good fluidity, excellent dispersibility, and efficient sintering performance, providing reliable material guarantee for the manufacturing of MLCC. At the same time, the high sintering copper paste developed by Advanced Institute (Shenzhen) Technology Co., Ltd. for YB5112 MLCC under the research platinum brand has also provided us with practical cases and reference basis. In the future, with the continuous development of electronic technology, we will continue to explore and optimize the formula and preparation process of high sintering copper paste, providing better material support for the manufacturing of electronic components.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.
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