The main characteristics of antioxidant copper foil (tin plated) are excellent antioxidant and corrosion resistance

    Anti oxidation copper foil (tin plated)It is a copper foil with a specially treated surface, characterized by excellent oxidation resistance and corrosion resistance. Its surface has undergone special treatment, coated with a layer of tin, forming a dense oxide layer on its surface, effectively preventing oxidation and corrosion.
Anti oxidation copper foil (tin plated) is commonly used as a high-quality conductive material and has been widely applied in fields such as electronics, communication equipment, and power electronics. Anti oxidation copper foil (tin plated) has the following characteristics:

1. Good antioxidant performance: The specially treated surface can effectively prevent oxidation and corrosion.

   
   

2. Good corrosion resistance: After tin plating on the surface, it can effectively resist chemical corrosion, especially in high temperature, high humidity, and highly corrosive environments.

   
   

3. Excellent conductivity: Copper foil, as a high-quality conductive material, has excellent conductivity. Anti oxidation copper foil (tin plated) has undergone special treatment on this basis to make its conductivity more stable.

   
   

4. High surface flatness: Anti oxidation copper foil (tin plated) has a high surface flatness, which can meet the requirements of high-precision circuit board processing.

   
   

5. Easy installation: Anti oxidation copper foil (tin plated) can be easily attached to the surface of the circuit board, making installation simple and convenient.

Anti oxidation copper foil (tin plated) is also a common typeBarrier film materialIt is mainly composed of metal ions such as copper and tin. It has good corrosion resistance and conductivity, which can isolate the contact between oxygen and electronic components, protecting internal components and circuits from corrosion and oxidation.

    Anti oxidation copper foil (tin plated)The main characteristics of it are smooth surface, good conductivity, and excellent corrosion resistance. It can be processed through processes such as electroplating, chemical deposition, and electrodeposition, and can be improved by adjusting chemical composition, process parameters, and process conditions.
When choosing antioxidant copper foil (tin plated), the following aspects need to be considered:
Resistance performance: Anti oxidation copper foil (tin plated) can be used for resistance and packaging of electronic components to provide good electrical connection and isolation.
● Conductivity: Anti oxidation copper foil (tin plated) can be used for circuit conduction and filtering to provide good conductivity.
Corrosion resistance: Anti oxidation copper foil (tin plated) has good corrosion resistance and can prevent components from being affected by corrosion and oxidation in the working environment.
Safety: Anti oxidation copper foil (tin plated) has good safety and will not cause harm to human body and the environment.
When choosing antioxidant copper foil (tin plated), it is necessary to evaluate and select according to specific circumstances to ensure that it meets application requirements and quality requirements.
For example, if there are higher requirements for the resistance performance, a barrier film with higher resistivity can be chosen; If there is a higher requirement for conductivity, a barrier film with better conductivity can be chosen.
Summary: Anti oxidation copper foil (tin plated), as a high-quality conductive material, has excellent oxidation resistance and corrosion resistance, and is widely used in the fields of electronics industry, communication equipment, power electronics, etc.