Effective preventive measures for nickel layer oxidation during storage of PI nickel plating film

PI nickel plating filmDue to its excellent conductivity and corrosion resistance, it plays an important role in the electronics industry. However, the oxidation of nickel layers during storage has always been a focus of attention in the industry. Oxidation not only affects the appearance of the product, but may also lead to a decrease in circuit performance or even failure. Therefore, researching and implementing effective preventive measures is particularly important.

Reasons for nickel layer oxidation

Before discussing preventive measures, it is necessary to first understand the reasons for nickel layer oxidation. The oxidation of nickel layer is mainly caused by the following factors:

1. Environmental humidity: High humidity environments can accelerate the oxidation process of the nickel layer.
2. Temperature changes: Fluctuations in temperature can promote oxidation reactions.
3. Chemical pollution: Chemical substances stored in the environment, such as sulfides and chlorides, can accelerate the oxidation of the nickel layer.
4. Physical damage: Physical damage exposes new nickel surfaces, increasing the risk of oxidation.

preventive measure

In response to the above oxidation reasons, Advanced Institute (Shenzhen) Technology Co., Ltd. has proposed the following effective preventive measures:

1. Environmental control

• Humidity control: Ensure that the relative humidity of the storage environment is below 60% to slow down the oxidation rate.
• Temperature management: Maintain stable storage environment temperature and avoid extreme temperature changes.

2. Chemical protection

• Clean storage environment: Regularly clean the storage area to avoid the accumulation of chemicals.
• Use antioxidant: Apply antioxidant on the surface of nickel plating film to form a protective layer and prevent oxidation.

3. Physical protection

• Avoid physical damage: Be careful during handling and storage to avoid physical damage to the PI nickel plating film.
• Use protective film: Cover the surface of the PI nickel plating film with a protective film to reduce the influence of external physical and chemical factors.

4. Regular inspections

• Regular inspection: Regularly inspect stored itemsPI nickel plating filmConduct inspections to promptly identify and address oxidation issues.

5. Packaging materials

• Use anti oxidation packaging: Choose packaging materials that can block oxygen and moisture, such as aluminum foil or vacuum packaging.

conclusion

The problem of nickel layer oxidation in PI nickel plating film during storage can be prevented through effective environmental control, chemical protection, physical protection, regular inspection, and selection of appropriate packaging materials.Advanced Institute (Shenzhen) Technology Co., LtdBy integrating these measures, a reliable solution has been provided to customers, ensuring the performance and stability of PI nickel plated film products.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.