How to improve the conductivity of printed silver paste in circuit board applications?

In the field of circuit board manufacturing, the conductivity of printed silver paste is directly related to the performance and reliability of electronic products. Advanced Institute (Shenzhen) Technology Co., Ltd. focuses on cutting-edge research in materials science, and its R&D of Research Platinum brand printing silver paste has emerged in the industry. improve Research Platinum Brand Printing Silver PasteThe conductivity performance in circuit board applications has become a focus of attention for many electronic manufacturing companies.

1、 Optimize the composition of silver paste

Silver powder is the core component of conductive printing silver paste. In the research and development of platinum brand printing silver paste, the Advanced Institute prioritizes the use of high-purity silver powder. The presence of impurities can hinder the conduction of electrons and reduce the conductivity of silver paste. By rigorously screening suppliers, we ensure that the purity of silver powder reaches over 99.9%, reducing electron scattering caused by impurities and laying the foundation for smooth electron transfer between silver powder particles.

The particle size and shape of silver powder have a significant impact on its conductivity. The research of the Advanced Institute shows that silver powder with smaller particle size can form a more compact stacking structure after solidification, increasing the number of electron conduction channels. Meanwhile, by mixing spherical and flake silver powders, the conductive network can be further optimized. Spherical silver powder can fill the gaps between flake silver powders, Flake silver powdersProvide a larger contact area to enable electrons to jump and conduct between silver powders more efficiently. In the research of platinum brand printing silver paste, the improvement of conductivity was achieved by precisely controlling the ratio of two shapes of silver powder.

Moderate additives can improve the performance of silver paste. For example, adding organic additives can improve the dispersibility of silver powder in the slurry and prevent agglomeration. Advanced Institute in Research Platinum Brand Printing Silver PasteSpecial dispersants have been added to ensure uniform distribution of silver powder throughout the system, avoiding a decrease in conductivity caused by uneven concentration of silver powder in certain areas. In addition, adding a small amount of metal salt additives can reduce the sintering temperature of silver powder to a certain extent, promote the fusion of silver powder during the curing process, and enhance the continuity of the conductive path.

2、 Improve the preparation process of printing silver paste

The mixing process is crucial in the preparation of silver paste. The advanced institute adopts a combination of high-speed stirring and ultrasonic dispersion method. High speed stirring can initially mix the components evenly, while ultrasonic dispersion can further break down the agglomerates of silver powder, allowing it to be fully dispersed in the organic carrier. By precisely controlling the stirring speed, time, ultrasonic power, and time, the uniformity of the silver paste for Yanbo brand printing is ensured, providing a stable slurry system for subsequent printing and curing processes.

The curing process determines the bonding state between silver powders, which in turn affects their conductivity. The Advanced Institute has conducted in-depth research on the curing conditions of silver paste for platinum brand printing. Properly increasing the curing temperature and prolonging the curing time can promote the sintering of silver powder, form stronger metal bond connections between silver powders, and reduce contact resistance. However, excessive temperature and prolonged time may cause oxidation of the silver layer or deformation of the substrate. Through extensive experiments, the optimal curing curve for different circuit board materials and application scenarios has been determined to ensure good conductivity without affecting the overall performance of the circuit board.

3、 Optimize the design and printing process of circuit boards

During the circuit board design phase, the circuit layout has an indirect impact on the conductivity of printed silver paste. The advanced institute suggests shortening the current path as much as possible, reducing bends and narrow parts of the line to lower resistance. Meanwhile, increasing the width of the wire reasonably, especially in areas carrying high currents, can effectively reduce current density and improve conductivity efficiency. By optimizing the layout of the circuit, the obstruction of electrons during transmission has been reduced, resulting in better performance of the conductivity of the silver paste printed by Yanbo brand.

The thickness and uniformity of printed silver paste are directly related to its conductivity. Advanced Institute adopts high-precision printing equipment and advanced printing technology in the production process to ensure Research Platinum Brand Printing Silver PasteThe printing thickness is uniform and consistent. A thin silver layer may result in incomplete conductive pathways, while a thick silver layer can increase costs and may lead to incomplete curing. By precisely controlling printing parameters such as scraper pressure, printing speed, and screen mesh size, precise printing of silver paste on circuit boards has been achieved, ensuring good conductivity.

Advanced Institute (Shenzhen) Technology Co., Ltd. has continuously improved the conductivity of printed silver paste in circuit boards through comprehensive optimization of the composition, preparation process, and application of platinum brand printed silver paste, providing high-quality material solutions for the development of the electronics industry and helping electronic products move towards higher performance and smaller size.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.