Can the filling accuracy of hole filling gold paste in semiconductor manufacturing meet the requirements?

With the rapid development of modern semiconductor technology, the requirements for hole filling accuracy in the manufacturing process are increasingly increasing. As a key material in semiconductor packaging, the filling performance of hole filling gold paste directly affects the quality and reliability of the product. This article will explore the issue of hole filling accuracy of gold paste in semiconductor manufacturing, and present the findings of Advanced Institute (Shenzhen) Technology Co., LtdYanbo brand YB8106 filling gold pasteFor example, through specific data analysis, whether the filling accuracy meets the requirements.

1、 Overview

In semiconductor manufacturing, hole filling gold paste is mainly used to fill the tiny pores between chips and substrates to achieve electrical connections and mechanical fixation. The filling accuracy not only affects the conductivity and reliability of the product, but also directly affects production efficiency and cost. Therefore, selecting the appropriate filling gold paste and optimizing its filling process is crucial for improving the quality and competitiveness of semiconductor products.

2、 Precision requirements for filling holes with gold paste

Semiconductor ManufacturingFilling gold pasteThe precision requirements for filling holes are extremely high, mainly reflected in the following aspects:

1. Filling integrity: It is required that the gold paste can completely fill the pores without voids or gaps. This usually requires a filling rate of over 95%.
2. Uniformity of filling: The distribution of gold paste in the pores should be uniform to avoid local accumulation or missing. This can be evaluated by measuring the thickness distribution of the gold paste within the pores, which generally requires a thickness deviation within ± 10%.
3. Filling accuracy: The filling of the gold paste should be precisely controlled to avoid overflow or insufficiency. This requires precision control within ± 5% during the filling process.

3、 Analysis of pore filling performance of YB8106 pore filling gold paste from Yanbo brand

Produced by Advanced Institute (Shenzhen) Technology Co., LtdYanbo brand YB8106 filling gold pasteDue to its excellent pore filling performance and stability, it has been widely used in the field of semiconductor manufacturing. The following is a detailed analysis of its hole filling accuracy:

1. Raw materials and formulas

The YB8106 pore filling gold paste from Yanbo brand uses high-quality raw materials, such as gold powder with a purity of 99.9%, as well as high-performance resins and additives. Through precise formula design, the thixotropy, plasticity, and pore filling performance of the gold paste are ensured.

2. Production process

Advanced Institute (Shenzhen) Technology Co., LtdAdopting advanced production processes such as three roll grinding and vacuum defoaming to improve the fineness and uniformity of the gold paste. By precisely controlling various parameters in the production process, such as grinding time (usually 2-4 hours), defoaming pressure (usually 0.1 MPa), etc., the excellent performance of the gold paste is ensured.

3. Hole filling accuracy test

In order to verify the filling accuracy of YB8106 pore filling gold paste from Yanbo brand, we conducted the following tests:

• Filling integrity test: Microscopic observation was used to examine the filled pores, and the results showed that the filling rate of the gold paste reached 98%, fully meeting the requirements for filling integrity.
• Filling uniformity test: Observe the pore cross-section after filling with a scanning electron microscope (SEM) and measure the thickness distribution of the gold paste. The results showed that the thickness deviation of the gold slurry in the pores was within ± 5%, far below the required ± 10%, demonstrating extremely high filling uniformity.
• Filling accuracy test: Use precision measuring instruments to measure the pore size after filling and compare it with the theoretical value. The results showed that the filling accuracy of the gold paste was controlled within ± 3%, far below the required ± 5%, demonstrating extremely high filling accuracy.

4、 Practical application cases

In practical applications,Yanbo brand YB8106 filling gold pasteExhibiting excellent pore filling performance and stability. For example, in the packaging process of high-end smartphones, the gold paste can completely fill the tiny pores between the chip and the substrate, ensuring the reliability of electrical connections and mechanical fixation. At the same time, its excellent filling accuracy and uniformity effectively improve the conductivity and reliability of the product, reducing the error rate in the production process.

5、 Conclusion

In summary, the filling accuracy of YB8106 hole filling gold paste from Yanbo brand fully meets the requirements in semiconductor manufacturing. Its excellent pore filling performance and stability are attributed to high-quality raw materials, precise formula design, advanced production processes, and strict testing standards. In the future, with the continuous development of semiconductor technology, Advanced Institute (Shenzhen) Technology Co., Ltd. will continue to devote itself to the research and innovation of hole filling gold paste, providing higher quality materials and services for semiconductor manufacturing.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.