What factors affect the conductivity of PEN copper plated film?

In the rapidly developing field of electronic materials, PEN (polyethylene naphthalate) copper plated film, as a high-performance composite material, has shown broad application prospects in multiple fields such as flexible electronics, display screens, capacitors, etc. due to its combination of the excellent physical properties of PEN film and the excellent conductivity of copper. This article will delve into the factors that affect the conductivity of PEN copper plated films, and combine reference data, data comparison, and the findings of Advanced Institute (Shenzhen) Technology Co., LtdAdvanced Institute PEN Copper Plating FilmAnalyze examples.

1、 Basic characteristics of PEN copper plated film

PEN copper plated film is a composite material made by depositing a layer of copper metal on the surface of PEN thin film through electroplating or chemical plating methods. This material not only inherits the high strength, high rigidity, weather resistance, and good electrical insulation properties of PEN film, but also endows excellent conductivity through copper coating. This unique combination of performance makesPEN copper plated filmBecoming a key material for preparing high-performance flexible electronic products and display screens.

2、 Factors affecting the conductivity of PEN copper plated film

1. Surface roughness

The surface roughness of PEN substrate has a significant impact on the adhesion and uniformity of copper plating layer. A rougher surface is conducive to the adhesion of copper plating and improves conductivity. Experimental data shows that the adhesion and conductivity of the copper plated film on PEN substrates treated with appropriate roughening are superior to those on untreated substrates.

2. Copper plating thickness

The thickness of the copper plating layer directly determines the quality of the conductivity. A thicker copper plating layer can provide better conductive channels, but excessive thickness may lead to a decrease in the bonding force between the coating and the substrate, which in turn affects the conductivity performance. Therefore, it is necessary to precisely control the thickness of the copper plating layer to achieve optimal conductivity.Advanced Institute (Shenzhen) Technology Co., LtdThe PEN copper plating film achieves precise control of the thickness of the copper plating layer through advanced electroplating technology, ensuring excellent conductivity.

3. Uniformity of copper plating

The uniformity of the copper plating layer is crucial for its conductivity. Uneven copper plating can lead to a decrease in local conductivity and even cause circuit failures. Therefore, strict control of process parameters is required during the electroplating process to ensure the uniformity of the copper plating layer. Advanced Institute PEN copper plating film adopts advanced electroplating equipment and technology to achieve high uniformity of the copper plating layer, ensuring the stability and reliability of the product.

4. Copper plating purity

The higher the purity of copper plating, the better the conductivity. High purity copper coating can reduce the influence of impurities on conductivity and improve the transmission efficiency of electrical signals. Advanced Institute (Shenzhen) Technology Co., Ltd. adopts high-purity copper source and strict process control in the copper plating process, ensuring the high-purity copper plating layer of Advanced Institute PEN copper plating film, thereby improving the conductivity of the product.

5. Electroplating solution formula and electroplating conditions

The formula of the plating solution and the conditions such as current density, temperature, and time during the plating process can all affect the composition, structure, and properties of the copper plating layer. The appropriate plating solution formula and optimized plating conditions can improve the purity and uniformity of the copper plating layer, thereby enhancing its conductivity. Advanced Institute (Shenzhen) Technology Co., Ltd. has optimized the plating solution formula and plating process parameters through continuous research and innovation, achieving industry-leading conductivity in the PEN copper plating film of Advanced Institute.

6. Environmental factors

Environmental factors such as temperature and humidity may also have an impactPEN copper plated filmThe conductivity has an impact. High temperature may lead to a decrease in the bonding force between the copper plating layer and the PEN substrate, thereby affecting the conductivity performance; Excessive humidity may lead to surface oxidation of the copper plating layer, reducing its conductivity. Therefore, it is necessary to pay attention to controlling the ambient temperature and humidity during use to maintain the good conductivity of PEN copper plating film.

3、 Conclusion

in summary,PEN copper plated filmThe conductivity of copper is influenced by various factors, including surface roughness, copper plating thickness, copper plating uniformity, copper plating purity, plating solution formula and plating conditions, as well as environmental factors. Advanced Institute (Shenzhen) Technology Co., Ltd. ensures the excellent performance of PEN copper plating film in terms of conductivity through advanced research and development technology, strict process control, and high-quality product quality. In the future, with the continuous development of electronic technology and the increasing demand for applications, PEN copper plating film will demonstrate its unique charm and broad application prospects in more fields.