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Double sided tinned copper foil and double-sided tinned rolled copper are usually used to provide good conductivity from the substrate through the adhesive surface to the foil substrate. Suitable for grounding and EMI shielding of electronic devices and components, the tin layer coated has good weldability and improves oxidation resistance and corrosion resistance.
This product will not reduce the shielding effect due to oxidation of the substrate or solder joints when assembled or mounted in electronic devices.
Attachment: The reduction of shielding effect will affect the clarity or purity of sound quality of electronic devices and other external (electromagnetic wave) influences.
Shielding performance
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