LTCC interlayer through-hole silver paste: advantages and application analysis

LTCC interlayer through-hole silver paste is a type of interlayer interconnect filling material designed for low-temperature co fired ceramic systemssilver conductive pasteIt has the characteristics of high reliability, high conductivity, etc., and can be compatible with LTCC ceramic strips for integrated co firing, with good sintering shrinkage matching. This article will provide an in-depth analysis of the advantages and applications of LTCC interlayer through-hole silver paste from multiple dimensions, in order to meet the most important concerns of the target readers about this product.

Advantage analysis:

The functional phase is self-made surface modified ultrafine silver powder, with moderate sintering activity and high conductivity. Compared with traditional silver paste, LTCC interlayer through-hole silver paste has moderate sintering activity through surface modified ultrafine silver powder, which ensures that its longitudinal shrinkage changes during sintering process will not have a significant impact on the quality of the through-hole. Meanwhile, its high conductivity can effectively improve the conductivity performance of the circuit.

Adding sintering shrinkage control components and inorganic bonding components that promote the bonding with the co firing interface of raw ceramics has good matching performance for filling pores and co firing. The sintering shrinkage control component is added to the silver paste of the LTCC interlayer through-hole. By precisely adjusting the shrinkage ratio of the sintered material, good matching with the ceramic ribbon is achieved, ensuring the sintering quality of the overall device. In addition, inorganic adhesive components were added to promote the bonding with the co firing interface of the ceramic, further enhancing the bonding strength between the filling and the ceramic and improving the reliability of the circuit.

Application analysis:

1. Application in the field of electronic products

The high reliability and conductivity of LTCC interlayer via silver paste make it a very important material in the field of electronic products. For example, in devices such as mobile phones, televisions, and computers, LTCC interlayer through-hole silver paste can be used to connect various components on the circuit board, such as chips, inductors, etc. High conductivity can ensure the stability and speed of signal transmission, while high reliability can improve the lifespan and stability of the device.

2. Applications in the field of automotive electronics

With the continuous development of automotive electronics, the demand for interconnection between various sensors and control units is also increasing. LTCC interlayer through-hole silver paste can be used to connect various modules in the automotive electronics field, such as engine control units, braking systems, air conditioning systems, etc., to achieve more efficient and reliable in car electronic systems.

3. Application in the field of medical equipment

Medical devices have extremely high requirements for reliability and stability, and the high reliability and conductivity of LTCC interlayer via silver paste can precisely meet these requirements. It can be used to connect internal implants, monitoring devices, medical imaging instruments, etc., ensuring the performance and accuracy of medical equipment.

Conclusion:

in summary,LTCC interlayer through-hole silver pasteIt has broad application prospects in fields such as electronic products, automotive electronics, and medical equipment. Its high reliability, high conductivity, and excellent co firing matching performance with ceramic ribbons make it an indispensable key material. In the future, we can foresee that LTCC interlayer through-hole silver paste will be applied in more fields and provide important support and assistance for the development of related industries.