High reliability and high conductivity LTCC interlayer via silver paste

Introduction: Low temperature co fired ceramic system for interlayer through-hole interconnection and fillingsilver conductive pasteIt is an innovative product with high reliability and conductivity. This article will provide a detailed introduction to the product characteristics of Advanced Institute Technology and its advantages in terms of circuit reliability after sintering.

1、 The functional phase is self-made surface modified ultrafine silver powder, with moderate sintering activity and high conductivity

In the process of preparing LTCC interlayer through-hole silver paste, we used self-made surface modified ultrafine silver powder as the functional phase. This silver powder has the characteristic of moderate sintering activity, which not only achieves good sintering effect under high temperature conditions, but also has high conductivity. The high or low conductivity is crucial for the performance of LTCC interlayer via silver paste, ensuring the stability and reliability of the circuit.

2、 Adding sintering shrinkage control components and inorganic bonding components that promote co firing interface bonding, the filling and co firing matching performance is good

In order to improve the filling and co firing matching performance of LTCC interlayer through-hole silver paste, we added sintering shrinkage control components and inorganic bonding components that promote the bonding with the ceramic co firing interface in the formula. The addition of these components can effectively control the shrinkage during the sintering process, resulting in better matching between the filling material and LTCC ceramic tape. Meanwhile, the presence of inorganic adhesive components can enhance the bonding strength between the filling material and LTCC ceramic tape, and improve the connection strength of interlayer through holes.

3、 The circuit reliability is good after sintering

The circuit reliability of LTCC interlayer through-hole silver paste after sintering is excellent. This is mainly due to its good compatibility and sintering shrinkage matching with LTCC ceramic strips. Through co firing experiments with ceramic green belts such as alumina/glass and alumina/microcrystalline glass, it has been shown that the silver paste has good pore filling co firing matching performance and can achieve high-quality co firing with various ceramic belts. In practical applications, sintered circuits have high reliability and can ensure the stable operation of electronic products during long-term use.

Conclusion:

Low temperature co fired ceramic system interlayerThrough-hole silver pasteIt is an innovative product with high reliability and conductivity. Its functional phase consists of self-made surface modified ultrafine silver powder, added sintering shrinkage control components, and inorganic bonding components, which endow it with excellent interlayer through-hole filling and co firing performance. In terms of circuit reliability after sintering, the silver paste performs well and can meet the stability requirements for long-term use of electronic products. Through continuous optimization of research and development, LTCC interlayer through-hole silver paste provides a reliable and efficient solution for the electronics industry.