Flexible thermal conductive materials have excellent thermal conductivity and mechanical properties

1、 Introduction

With the continuous development and progress of electronic devices, thermal management of electronic devices has become increasingly important. Among them, heat dissipation technology is one of the key factors to ensure the normal operation of electronic devices. Traditional heat dissipation technologies generally include radiators, cooling fans, etc. These traditional radiators are usually made of metal or plastic materials, which have complex structures, high manufacturing costs, and poor heat dissipation performance. (取决于上下文，如"but"Flexible thermal conductive materialDue to its unique structure and excellent performance, it can meet the requirements of thermal management and heat dissipation for electronic devices.

2、 Preparation method of flexible thermal conductive material

Thermal conduction medium method

The heat conduction medium method is one of the most commonly used methods for preparing flexible thermal conductive materials. This method is to disperse the flexible thermal conductive material to be prepared in a certain heat transfer medium, and melt or sinter it by heating to form the flexible thermal conductive material. This method has the advantages of simple preparation process, low cost, and easy control. Common heat transfer media include silicone oil, epoxy resin, silicone rubber, etc.

Thermal radiation method

This method involves mixing the flexible thermal conductive material to be prepared with a certain heat radiation medium to form a flexible thermal conductive material. Common heat radiation media include metals such as gold, silver, platinum, and their alloys.

micromachining

Micro machining method refers to the process ofFlexible thermal conductive materialThe method of adding specific components or structures to improve its thermal insulation and mechanical properties. Micro machining methods can be divided into two types: hot deformation and micro extrusion. Thermal deformation refers to the compression or stretching of flexible thermal conductive materials to a specific shape; Micro extrusion refers to compacting or sintering flexible thermal conductive materials to a certain size. The commonly used microfabrication methods include hot pressing molding, hot pressing sintering, etc.

3、 Structure and Performance of Flexible Thermal Conductive Materials

Flexible thermal conductive materials are typically composed of a substrate and a thermal conductive medium. Among them, the matrix is usually an organic polymer compound or polymer, which has good flexibility and compressibility, and can meet various application needs; Thermal conductive medium refers to a matrix filled with a large amount of fibrous substances or fillers to improve its thermal insulation and mechanical properties.

Flexible thermal conductive materials typically have excellent thermal insulation and mechanical properties. Its thermal insulation performance is mainly reflected in the following aspects:

(1) Thermal radiation: By transferring thermal energy to the fibrous material or filler covered on the surface of a flexible thermal conductive material, the purpose of transferring heat to the entire or partial medium of the composite material is achieved;

(2) Micro deformation: By compressing or stretching the heat conducting medium, it undergoes deformation to enhance its thermal insulation performance;

(3) Thermal expansion coefficient: By compressing or stretching flexible thermal conductive materials to produce a thermal expansion coefficient, their thermal insulation performance can be improved;

Application of Flexible Thermal Conductive Materials in Electronic Devices

As the connection between chips and processors in electronic devices becomes increasingly complex and compact, the application of flexible thermal conductive materials in electronic devices is also becoming more and more widespread. Here are some typical application scenarios:
(1) Electronic device heat dissipation: Flexible thermal conductive materials can be used to manufacture heat sinks, cooling fans, and other heat dissipation devices for electronic devices to help them dissipate heat better. Traditional heat sinks have complex structures and high manufacturing costs, while flexible thermal conductive materials are relatively lightweight and easy to process, making them widely used in the field of heat dissipation for electronic devices.

(2) Flexible screen heat dissipation: Flexible thermal conductive materials can be used to manufacture shells with good heat dissipation performance for flexible screens, to help the screen dissipate heat better.

(3) PCB board thermal conductivity: Flexible thermal conductive materials can be used to manufacture thermal components for PCB boards to help them dissipate heat better.