Thick film conductor paste is a key technology in contemporary circuit manufacturing, providing comprehensive solutions for thick film circuit wiring on various substrates. Series of Advanced Institute Technology Development
Thick film precious metal pasteNot only does it include multiple mature product types, but it can also adapt to different process windows and meet the diverse needs of circuit manufacturing. This article will analyze the unique features of thick film conductor paste from several key perspectives, fully revealing its importance in circuit manufacturing for readers.
1、 Diversified product types
1. Au paste: It has excellent conductivity and is suitable for applications that require high conductivity.
Example: The thick film wires of a high-speed processor are prepared using Au paste, which has excellent conductivity and effectively supports the high-speed operation of the processor.
2. Ag paste: A widely used paste variety in circuit manufacturing, with good conductivity and excellent oxidation resistance.
Example: The thick film circuit in a certain aviation electronic equipment is prepared using Ag paste, and after years of use, it still maintains stable performance, proving its excellent oxidation resistance.
3. AgPd paste, AI paste, AIPd paste, etc.: The development of these pastes marks a further improvement in the conductivity and stability of thick film conductor pastes.
Example: The thick film circuit in a certain high-temperature electronic ceramic is prepared using AgPd slurry, which exhibits excellent heat resistance and conductivity in high-temperature environments, successfully meeting the circuit requirements under extreme working conditions.
2、 Product performance
1. Conductive adhesive cured at 120~300 ℃: suitable for low-temperature process requirements, with good adhesive and conductive properties.
Example: The thick film wires in a certain drive circuit use conductive adhesive cured at 120~300 ℃, which not only achieves reliable connection but also meets the high-speed transmission requirements of the circuit.
2. Sintering slurry in the temperature range of 400~1600 ℃: suitable for high-temperature process requirements, capable of maintaining stable conductivity in extreme environments.
Example: The thick film circuit of a certain aerospace electronic device was prepared using sintered paste in the range of 400-1600 ℃, successfully meeting the working requirements of aerospace devices in extreme high temperature environments.
1. Aluminum oxide: Thick film conductor paste can be used to prepare high-quality and highly conductive circuits on aluminum oxide substrates, and is widely used in fields such as power electronics and aerospace.
2. Aluminum nitride: As a high-temperature material, the thick film conductor paste on aluminum nitride can meet the circuit wiring requirements under high-temperature conditions and is widely used in high-temperature electronic devices.
3. Ferrite: The application of thick film conductor paste on ferrite materials has increased its conductivity, making it have broader application prospects in circuit manufacturing and electromagnetic induction fields.
4. Microwave ceramics, glass glazes and other substrates: Thick film conductor paste can achieve precise wiring on these special substrates, providing strong support for the development of microwave devices and glass processes.
Conclusion:
Thick film conductor paste, as an important tool in contemporary circuit manufacturing, provides a comprehensive solution for circuit manufacturing through diversified product types, adaptability to diverse process windows, and a wide range of application fields. With the continuous advancement of technology,
Thick film conductor pasteThe performance will be further improved, injecting new vitality into the development of the electronics industry. I believe that in the future, thick film conductor paste will play a more important role in the field of circuit manufacturing.
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