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Sintering encapsulation slurryIt is a polymer material commonly used for sealing and protection in the manufacturing process of electronic components. It has the advantages of good chemical corrosion resistance, insulation, waterproofing, and high temperature resistance, and is widely used in the packaging and sealing of various electronic devices and circuit boards.
Sintering encapsulation slurry is usually a mixture composed of epoxy resin, filler, and curing agent. When in use, it is coated on the surface of electronic components, and after a certain heating and curing treatment, a hard encapsulation layer will be formed to protect the components from external environmental influences.
The sintered encapsulation slurry has the following characteristics:
Chemical corrosion resistance:Sintering encapsulation slurryIt can be used for a long time in various chemical solutions such as acid, alkali, salt, etc., without being corroded and causing component failure.
High temperature tolerance: The sintered encapsulation slurry can be used in high temperature environments, and most products can withstand high temperatures above 150 ℃, and some can even withstand extremely high temperatures above 300 ℃.
Insulation: The sintered encapsulation slurry has good insulation properties and can effectively isolate the influence of external environment on components.
Waterproof: The sintered encapsulation slurry can prevent moisture and dampness from entering the interior of the components, effectively preventing rusting and damage in humid environments.
Good processing performance: The sintered encapsulation slurry has excellent fluidity and plasticity, making it easy to coat and process into various shapes.
When using sintered encapsulation slurry, the following points should be noted:
Selection of curing agent: Different types of epoxy resins require different curing agents, so it is important to choose the curing agent that suits your needs when selecting.
Coating method:Sintering encapsulation slurryCoating can be done through spraying, brushing, dripping, and other methods. During the coating process, attention should be paid to the thickness and uniformity of the coating.
Heating conditions: The temperature and time of the sintered encapsulation slurry need to be controlled during the heating process to ensure the curing effect. Usually, an oven or hot air gun is used for heating treatment.
In addition to its application in electronic component manufacturing, sintered encapsulation paste can also be used in other fields. For example, in the field of architecture, it can be coated on walls and floors to achieve waterproofing and anti-corrosion effects; In the aerospace field, it can also be used for sealing equipment such as aircraft and rockets.
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