1、 Background
850 degrees
Sintering encapsulation slurryIt is a high-temperature packaging material widely used in the electronics industry. Its main function is to enclose electronic components, protect them from external environmental influences, and ensure their normal operation. In recent years, the application of 850 degree sintering encapsulation slurry in the electronics industry has become increasingly widespread, and its technical level has also been continuously improved.
2、 Technical features
The main technical characteristics of the 850 degree sintered encapsulation slurry are as follows:
Good high-temperature stability: The 850 degree sintered encapsulation slurry has good stability in high-temperature environments and can maintain its original properties.
Strong chemical corrosion resistance: The 850 degree sintered encapsulation slurry has good chemical corrosion resistance and can resist the erosion of chemical substances such as acid and alkali.
Good insulation performance: The 850 degree sintered encapsulation slurry has good insulation performance and can effectively isolate the electrical connection between electronic components and the external environment.
High thermal conductivity: The 850 degree sintered encapsulation slurry has a high thermal conductivity, which can quickly dissipate the heat generated by electronic components to ensure their normal operation.
3、 Technical application
The 850 degree sintered encapsulation slurry is mainly used in the following fields:
Electronic component packaging:
850 degree sintered encapsulation slurryIt can be used for packaging electronic components, protecting them from external environmental influences to ensure their normal operation.
Electronic circuit board packaging: 850 degree sintered packaging paste can be used for packaging electronic circuit boards, isolating the electrical connection between the electronic circuit board and the external environment to ensure the normal operation of the electronic circuit board.
Thermal conductive material: The high thermal conductivity characteristics of the 850 degree sintered encapsulation slurry can be used to manufacture thermal conductive materials, which conduct the heat generated by electronic components to ensure their normal operation.
4、 Technical advantages
The 850 degree sintered encapsulation slurry has the following technical advantages:
Good anti-aging performance: 850 degree sintering enveloping slurry has good anti-aging performance and can maintain its long-term stability.
Good high temperature resistance: The 850 degree sintered encapsulation slurry has good high temperature resistance and can maintain its normal performance in high temperature environments.
Good moisture resistance: The 850 degree sintered encapsulation slurry has good moisture resistance, which can effectively prevent moisture erosion and maintain its long-term stable performance.
5、 Technology Outlook
In the future, the application fields of 850 degree sintering encapsulation slurry will be more extensive. With the continuous development of the electronics industry, the demand for high-temperature packaging materials is also increasing. Therefore, the technological level of 850 degree sintering encapsulation slurry will continue to improve to meet the constantly changing market demand. At the same time, the application fields of 850 degree sintered encapsulation slurry will continue to expand, involving more industry sectors. We believe that, driven by continuous technological innovation and market demand, the 850 degree sintered encapsulation slurry will achieve greater development and application in the future.
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