SMD coated PI gold plated film and tin plated film

SMD (Surface Mount Device) is a widely used component in modern electronics industry. SMD components have the advantages of small size, light weight, high reliability, and space saving, and are therefore widely used in various electronic products. In the manufacturing process of SMD components, including PI gold-plated filmand Tin plated filmThe two steps have a significant impact on the quality and performance of SMD components.
1、 SMD coated PI gold plating film
PI is the abbreviation for polyimide film, which is a very excellent high-temperature material. In the manufacturing process of SMD components, PI needs to be coated to protect the circuit and structure of the components. PI coating can effectively prevent mechanical and environmental damage to components during use, improving their reliability and service life.
At the same time as PI coating, gold film plating is also required. Gold film is a commonly used electroplating material with good conductivity and corrosion resistance. The plating of gold film can effectively improve the electrical performance and stability of SMD components, and enhance their service life and reliability. The thickness of the gold film is generally between 0.11.0 microns and can be adjusted according to the specific requirements of the component.
     PI gold-plated filmIn the manufacturing process, multiple factors need to be considered, such as the thickness of the gold film, the concentration and temperature of the plating solution, and the current density. These factors will all affect the quality and performance of the gold film. Therefore, fine control is required during the manufacturing process to ensure the uniformity and consistency of the security film.

2、 SMD coated tin plated film
In addition to PI gold plating film, tin plating film treatment is also required during the manufacturing process of SMD components. Tin plated filmIt is a commonly used electroplating material with good corrosion resistance and conductivity. The main function of tin plated film is to protect the surface of components and prevent them from being affected by oxidation and corrosion during use.
In the manufacturing process of SMD components, the thickness of tin plating film is generally between 0.53.0 microns, which can be adjusted according to the specific requirements of the components. In the manufacturing process of tin plated film, multiple factors need to be considered, such as the concentration and temperature of the plating solution, current density, etc. These factors will all affect the quality and performance of tin plated film. Therefore, precise control is required during the manufacturing process to ensure the uniformity and consistency of the tin plated film.
Summary:
SMD coating PI gold-plated filmTin plating film is two important steps in the manufacturing process of SMD components. PI coating can effectively protect the circuit and structure of components, improve the reliability and service life of components; The plating of gold film can improve the electrical performance and stability of electronic components. The main function of tin plated film is to protect the surface of components and prevent them from being affected by oxidation and corrosion during use. In the manufacturing process, it is necessary to finely control various parameters to ensure the quality and performance of SMD components.