4.5 μ m PP film (or PET film) coated with 1 μ m copper is a composite material

    Electroless CopperThe technology began in 1947, when Narcus first reported the chemistry of electroless copper plating solutions. The stability of the initial stage of chemical copper plating solution is poor, the solution is prone to automatic decomposition, and the plating range cannot be controlled. Sediments are present in all areas in contact with the solution. The true concept of commercial electroless copper plating emerged in the 1950s, and with the development of through-hole metallization in printed circuit boards (PCBs), electroless copper plating was first applied. The first modern chemical copper plating solution was published by Cahill in 1957, using an alkaline tartaric acid copper plating bath and formaldehyde as a reducing agent. Now, after more than 50 years of development and research, a relatively complete knowledge of solution chemistry and process technology for chemical plating has been formed, and a preliminary theoretical system has been established.

Chemical copper plating is a process in which copper ions are reduced and precipitated on surfaces with catalytic active substances such as palladium through the action of reducing agents such as formaldehyde. The advantages of electroless copper plating over electroplated copper mainly include:
① Wide range of matrix;
② Uniform coating thickness:
③ Simple process equipment:
④ The coating has good performance.