Filling in through holes is an important step in electronic device manufacturing, using high conductivity materials
Gold conductor pasteIt can achieve excellent adhesion and conductivity of the pore wall. This article will introduce Advanced Institute Technology YB-8815, a high conductivity gold conductor paste, as well as its design and application in airtight filling of through holes.
1、 The importance of filling through holes
Through holes are important channels used in electronic devices to connect different levels of circuits, and their quality directly affects the performance and reliability of the equipment. Filling the through-hole is the key to achieving airtightness between the conductive and insulating materials inside the through-hole. Therefore, choosing a high conductivity gold conductor paste is very important.
2、 Characteristics of Advanced Institute Technology YB-8815 Gold Conductor Paste
Advanced Institute Technology YB-8815 is a mixed bonding gold conductor paste, mainly composed of gold particles and organic colloidal materials. This slurry has the characteristic of high conductivity, which can effectively conduct current and achieve conductive connection inside the through-hole.
3、 Excellent adhesion
Advanced Institute of Technology YB-8815 Gold Conductor PasteThrough special technical processing, it has excellent adhesion on the through-hole walls of ceramic substrates. This adhesion ensures that the conductive material is always in stable and firm contact with the substrate inside the through-hole, avoiding problems such as poor conductivity or open circuit caused by material detachment.
4、 Design scheme for airtight filling of through holes
In order to achieve airtightness inside the through-hole, the design of filling the through-hole is crucial. Using advanced technology from the institute
YB-8815 gold conductor pasteWhen filling through holes, the following solutions can be adopted:
1. Precise control of slurry viscosity: By controlling the viscosity of the slurry, uniform coverage between the slurry and the through-hole wall can be ensured during the filling process. This can avoid the occurrence of large pores or bubbles, thereby ensuring that the filled through-hole has good airtightness.
2. Appropriate filling pressure: During the filling process, appropriate filling pressure can fully fill the through-hole with the gold conductor slurry and tightly adhere to the through-hole wall. This can avoid gaps in the middle and ensure that the conductive path inside the through-hole is unobstructed.
3. Strictly control the filling temperature: When filling through holes, it is also necessary to control the filling temperature to ensure the fluidity and curing effect of the slurry during the filling process. Appropriate filling temperature can maintain the uniformity of the material during the filling process and form a stable conductive layer after curing.
5、 Application of Advanced Institute Technology YB-8815 in Filling Through Holes
Advanced Institute Technology YB-8815 gold conductor paste is widely used for through-hole filling on alumina substrates. The experimental results show that the through-hole filled with YB-8815 has excellent conductivity and can effectively maintain airtightness.
6、 Conclusion
Filling through holes is an important step in electronic device manufacturing, and high conductivity
Gold conductor pasteIt can achieve excellent adhesion and conductivity of through-hole walls. Advanced Institute Technology YB-8815 gold conductor paste has excellent performance in the field of through-hole filling, and its design scheme can ensure that the filled through-hole has good airtightness. By using this gold conductor paste, the reliability and performance of electronic devices can be improved.
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