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Industry news

Double sided nickel plating on aluminum foil refers to coating a layer of nickel on the substrate to improve its conductivity

Time:2023-02-28Number:1193
     Aluminum foil double-sided nickel platingIt is an electronic packaging technology that mainly achieves packaging by covering the surface of an electronic substrate with aluminum foil, then tightly bonding it by hot pressing, and then nickel plating to form a metal connection layer. Aluminum foil double-sided nickel plating technology has excellent electrical characteristics and bonding strength, as well as advantages such as high temperature resistance, corrosion resistance, small size, and light weight. Its application range is very wide, and it is widely used in the packaging of consumer electronic products. The application range of double-sided nickel plating technology for aluminum foil is very wide, which can be used for packaging circuit boards, automotive electronic components, consumer electronics, solar cell modules, and smartphones.

铝箔双面镀镍是一种电子封装技术,它主要通过将铝箔覆盖在电子基板的表面

    Double sided nickel plating on aluminum foil refers to coating a layer on the substratenickelTo improve the conductivity of the substrate;

Nickel plating refers to the process of depositing metallic nickel on the surface of a substrate using chemical or electrochemical methods.

    Nickel plating on aluminum foilSuitable for composite packaging materials, wires and cables, film materials, composite materials, electrical insulation materials, insulation coatings, and other metal powder products, mainly used for data cables in the electronics industry;

Conductive film is a conductive thin film or coating made of polymer conductive materials such as silver paste or tin paste.

The coating includes: metal coating; Hot pressed coating film; Chemical nickel plating; Electroplating nickel plating; Chemical nickel coating.

Application scope: Conductive thin films, nickel plating on metals.


The nickel plated metal connection layer can effectively reduce the resistance of the circuit board, improve the conductivity of the circuit board, and enhance the bonding strength of various electronic components, meeting the electrical characteristics and bonding strength requirements for electronic product packaging. In addition, Aluminum foil double-sided nickel platingTechnology also has certain cost advantages, with lower production costs and the ability to increase the density of circuit boards, thereby saving space, shortening equipment volume, and ultimately saving costs. In summary, the double-sided nickel plating technology for aluminum foil has excellent electrical characteristics and bonding strength, as well as advantages such as high temperature resistance, corrosion resistance, small size, and light weight. Its application range is very wide, and it is widely used in the packaging of consumer electronic products. The double-sided nickel plating technology for aluminum foil has certain cost advantages, which can increase the density of circuit boards, save space, shorten the volume of equipment, and thus save costs.
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