Has the soldering performance of copper foil improved after tin plating?

In the field of modern electronic manufacturing, copper foil is an important conductive material, and its soldering performance directly affects the quality and reliability of products. In order to improve the welding performance and oxidation resistance of copper foil, tin plating technology on the surface of copper foil has been widely used. This article will exploreCopper foil tin platingWhether the welding performance has been improved, and analyze it in combination with the copper foil tin plating products of Advanced Institute (Shenzhen) Technology Co., Ltd.

1、 Overview of Copper Foil Tin Plating Technology

Copper foil tin plating is a process of depositing a layer of tin on the surface of copper foil to improve its conductivity, oxidation resistance, and soldering performance. Tin plating can effectively prevent copper from rusting in humid environments, while improving the wettability and bonding strength during welding.

2、 Analysis of Welding Performance of Copper Foil after Tin Plating

In order to evaluate the welding performance of tin plated copper foil, we conducted the following experiments:

1. Experimental materials:
   • Advanced Institute (Shenzhen) Technology Co., LtdCopper foil tin plated products provided
   • Ordinary copper foil
2. Experimental method:
   • Use a soldering iron to weld copper foil and tin plated copper foil, and observe the welding effect.
   • Perform tensile shear tests on welded joints to test their bonding strength.
3. Experimental results:
   • Welding effect: whether it is copper foil orTin plated copper foilThey are all very easy to weld. But under a magnifying glass, the solder joints of the tinned copper foil are more uniform, and there is no welding defect caused by copper oxidation.
   • Tensile shear test: Tensile shear test was conducted on the welded joints of copper foil and tin plated copper foil. The results showed that the maximum tensile shear force of the welded joint of tinned copper foil was 1254N, while the maximum tensile shear force of the welded joint of ordinary copper foil was 980N. This indicates that the welded joint of tinned copper foil has higher bonding strength.

3、 Analysis of the reasons for the improvement of welding performance of copper foil after tin plating

1. Wettability improvement: Tin plating can significantly enhance the wettability of copper foil surface, making it easier for solder to spread on the copper foil surface and form uniform solder joints.
2. Enhanced oxidation resistance: Tin plating can effectively prevent copper from oxidizing during the welding process, thereby avoiding the occurrence of welding defects.
3. Improved bonding strength: The tin plating layer and solder can form a good metallurgical bond, thereby improving the bonding strength of the welded joint.

4、 Advantages of Advanced Institute Technology Copper Foil Tin Plating Products

As an enterprise dedicated to the research and production of electronic materials, Advanced Institute (Shenzhen) Technology Co., Ltd. has the following advantages in its copper foil tin plated products:

1. High quality tin plating layer: Advanced tin plating technology is adopted to ensure that the tin plating layer is uniform, dense, and has good adhesion and oxidation resistance.
2. Excellent welding performance: The welding performance of tin plated copper foil is significantly improved, which can meet the needs of various complex welding processes.
3. Environmental protection and energy conservation: Tin plating process meets environmental requirements and has low energy consumption, which is conducive to reducing production costs and environmental pollution.

5、 Conclusion

in summary,Copper foil tin platingIt can significantly improve its welding performance afterwards. Through advanced tin plating technology, the copper foil tin plated products of Advanced Institute (Shenzhen) Technology Co., Ltd. not only have high-quality tin plating layers, but also exhibit excellent welding performance and environmental protection and energy-saving characteristics. Therefore, copper foil tin plating technology has broad application prospects in the field of electronic manufacturing.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.