en 
Wechat QRcode
Hotline:0755-22277778
Tel：0755-22277778
Mobile：13826586185（Mr.Duan）
Fax：0755-22277776
E-mail：duanlian@xianjinyuan.cn
Low temperature pressureless adhesive sintering of silverIt is a commonly used electronic packaging technology, mainly applied in LED packaging, power module packaging and other fields. It uses a mixture of silver powder and organic components to prepare dispensing materials, which are dispensed under specific conditions and tightly bonded to chips or substrates through sintering processes.
The biggest feature of this technology is that the sintering temperature is relatively low, usually below 200 ℃, and no pressure is required, which can effectively avoid component failure caused by high temperature or high pressure. At the same time, this technology also has excellent conductivity and thermal conductivity, which can improve the reliability and heat dissipation performance of components.
The application range of low-temperature pressureless adhesive sintering silver technology is very wide, involving many industries. Taking LED packaging as an example, it can improve the luminous efficiency and stability of LED components; In terms of power module packaging, it can improve the reliability and heat dissipation performance of the power module, thereby ensuring the long-term stable operation of the equipment.
Low temperature pressureless adhesive sintered silver is widely used in the field of electronic packaging. The following are the main uses of this technology:
LED packaging: In LED packaging, using this technology can improve luminous efficiency and stability, ensuring the long-term stable operation of LED components.
Power module packaging: In terms of power module packaging, this technology can improve the reliability and heat dissipation performance of power modules, thereby ensuring the long-term stable operation of equipment.
Welding materials:Low temperature pressureless adhesive sintering of silverIt can also be used as a soldering material to connect electronic components or circuit boards.
Thermal interface materials: This technology can also be used to prepare thermal interface materials for improving the heat dissipation performance of electronic components.
3D printing materials: Low temperature pressureless adhesive sintered silver materials can also be applied in the field of 3D printing to manufacture components with good conductivity and thermal conductivity.
When purchasing low-temperature pressureless adhesive sintered silver, the following points should be noted:
Determine product quality: Choose products from well-known brands or certified manufacturers to ensure product quality and effectiveness.
Understanding product performance: Before purchasing, it is necessary to have detailed information about the physical and chemical properties of the product in order to determine the appropriate product based on actual needs.
Pay attention to storage conditions: Low temperature pressureless adhesive sintered silver needs to be stored in a dry, cool, and ventilated environment to avoid being affected by moisture and high temperatures.
Check the packaging label: Pay attention to whether the production date, shelf life, batch number and other information of the product are clear and explicit, and prevent the purchase of counterfeit and inferior products.
If you need this product or would like to learn more about related issues or product information, please contact us. We will solve your problems and provide services:
Advanced Institute (Shenzhen) Technology Co., Ltd， © two thousand and twenty-onewww.avanzado.cn. All rights reservedGuangdong ICP No. 2021051947-1 © two thousand and twenty-onewww.xianjinyuan.cn. All rights reservedGuangdong ICP No. 2021051947-2