Through hole silver paste for low-temperature co firing: the mainstream technology for electronic packaging

Introduction: Low temperature co firing technology (LTCC) is widely used in the field of electronic packaging, among whichThrough hole silver paste for low-temperature co firingIt is the core component of this technology. This article will focus on introducing the characteristics, preparation methods, and application fields of through-hole silver paste for low-temperature co firing, and explore its important role in achieving high integration and high-performance electronic packaging.

1、 Characteristics of through-hole silver paste for low-temperature co firing

1. High conductivity: Through hole silver paste used for low-temperature co firing has low resistance and can provide good current conductivity, meeting the requirements of high-performance electronic packaging for electrical signal transmission.

2. Good soldering performance: Through hole silver paste can achieve good soldering connection with metal pins on electronic components, ensuring stable signal transmission.

3. Excellent thermal conductivity: The high thermal conductivity of through-hole silver paste used for low-temperature co firing enables it to effectively disperse and dissipate the heat generated in electronic packaging, ensuring the stability of electronic components.

2、 Preparation method of through-hole silver paste for low-temperature co firing

1. Material selection and ratio: The preparation of through-hole silver paste first requires the selection of suitable raw materials, such as silver powder, organic solvents, thickeners, etc., and the reasonable ratio should be made according to the application requirements.

2. Mixing and dispersion: Place the selected material into a high-speed mixer for mixing and dispersion, ensuring that the silver powder is evenly dispersed in the solvent.

3. Sieve and defoaming: After stirring and dispersing, the slurry needs to be sieved to remove particles and obtain a uniform and fine through-hole silver slurry, which is then subjected to defoaming treatment to improve the quality of the slurry.

4. Printing and sintering: The prepared through-hole silver paste is applied to the substrate through printing technology, and then sintered at an appropriate temperature through sintering process to form a dense connection between the through-hole silver paste and the substrate.

3、 Application fields of through-hole silver paste for low-temperature co firing

1. Wireless communication equipment: Through hole silver paste is widely used in wireless communication equipment, which can connect antenna modules and circuit boards to achieve efficient signal transmission.

2. Automotive Electronics: Low temperature co firing technology is becoming increasingly important in the field of automotive electronics. Through hole silver paste is used to connect automotive electronic components, improving system performance and reliability.

3. Global Positioning System Receiver Components: Through hole silver paste is widely used in the manufacturing of global positioning system receiver components to achieve high-precision positioning and navigation functions.

4. Other fields: Low temperature co firing through-hole silver paste is also used in biomedical, aerospace and other fields to meet the demand for high-performance electronic packaging in different fields.

Summary: The introduction of low-temperature co firing technology has made breakthrough progress in the field of electronic packaging, and low-temperature co firing is used forThrough-hole silver pasteThe application is a crucial part of it. Through high conductivity, good soldering performance, and excellent thermal conductivity, low-temperature co firing through-hole silver paste meets the requirements of high integration and high-performance electronic packaging. In the future, with the continuous development of electronic packaging technology, low-temperature co firing through-hole silver paste will also demonstrate its important value in a wider range of application fields.