How to control the film thickness uniformity of silver palladium paste in thick film hybrid integrated circuits?

Thick film hybrid integrated circuit (HIC) is a circuit form that integrates passive components such as resistors, capacitors, inductors, and semiconductor devices on the same substrate. Among them, silver palladium paste, as an important conductive material, is widely used in the manufacturing process of HIC. However, the uniformity of the film thickness of silver palladium paste directly affects the performance and reliability of the circuit. Therefore, how to control the film thickness uniformity of silver palladium paste has become one of the key issues in thick film hybrid integrated circuit manufacturing. This article will explore this issue and introduce Advanced Institute (Shenzhen) Technology Co., Ltd. and itsYanbo brand thick film hybrid integrated circuit silver palladium pasteRelated technologies.

1、 The role and characteristics of silver palladium paste in thick film hybrid integrated circuits

Silver palladium paste is a composite of two metals, silver and palladiumconductive pasteIt has excellent conductivity, high temperature resistance, and good antioxidant capacity. In thick film hybrid integrated circuits, silver palladium paste is mainly used to make conductive paths, resistors, and other passive components. The uniformity of its film thickness directly affects the conductivity, resistance stability, and overall reliability of the circuit.

2、 Factors affecting the uniformity of silver palladium paste film thickness

The factors that affect the uniformity of silver palladium paste film thickness mainly include the following aspects:

1. Rheological properties of pulp: The rheological parameters such as viscosity and flowability of pulp directly affect the uniformity of film thickness during the printing process. Excessive or insufficient viscosity can lead to uneven film thickness.
2. Printing process: Printing pressure, printing speed, scraper angle and other printing process parameters also have a significant impact on the uniformity of film thickness. Excessive or insufficient printing pressure, as well as fast or slow printing speed, can all lead to uneven film thickness.
3. The flatness of the substrate: The flatness of the substrate surface also affects the uniformity of the film thickness. The unevenness of the substrate surface can lead to uneven film thickness.
4. Sintering process: Sintering parameters such as sintering temperature, sintering time, and cooling rate can also affect the uniformity of film thickness. Excessively high or low sintering temperature, and excessively long or short sintering time can all lead to uneven film thickness.

3、 Method for controlling the uniformity of silver palladium paste film thickness

1. Optimize the rheological properties of the slurry

By optimizingSilver palladium pasteThe rheological properties can significantly improve the uniformity of its film thickness. For example, the viscosity and flowability of the slurry can be adjusted by adjusting the proportion of additives such as solvents, plasticizers, and dispersants in the slurry. In addition, advanced dispersion technology and mixing process can also improve the uniformity of the slurry.

2. Improve printing technology

Improving printing technology is also an important method to enhance the uniformity of silver palladium paste film thickness. For example, high-precision screen printing machines can be used to precisely control process parameters such as printing pressure, printing speed, and scraper angle. In addition, using advanced printing molds and templates can also improve the uniformity of film thickness.

3. Improve the flatness of the substrate

Improving the flatness of the substrate is also an effective method to control the uniformity of silver palladium paste film thickness. For example, high-precision substrate processing equipment can be used to ensure the flatness of the substrate surface. In addition, advanced substrate cleaning and processing techniques can also improve the flatness of the substrate.

4. Optimize sintering process

Optimizing sintering process is also an important means to improve the uniformity of silver palladium paste film thickness. For example, high-precision sintering furnaces can be used to precisely control process parameters such as sintering temperature, sintering time, and cooling rate. In addition, the use of advanced sintering atmosphere control technology can also improve the uniformity of film thickness.

4、 Advanced Institute (Shenzhen) Technology Co., Ltd. and its research platinum brand thick film hybrid integrated circuit silver palladium paste

Advanced Institute (Shenzhen) Technology Co., Ltd. is a high-tech enterprise specializing in the research and production of electronic pastes. The research platinum brand thick film hybrid integrated circuit silver palladium paste produced by the company has excellent conductivity, high temperature resistance, and good oxidation resistance. Its film thickness uniformity is high, suitable for the manufacturing of various high-precision and high reliability thick film hybrid integrated circuits.

The experimental results show that,Yanbo brand thick film hybrid integrated circuit silver palladium pasteThe uniformity of film thickness on different substrates can reach over 95%, far exceeding the industry average. In addition, the company's silver palladium paste also has good printing and sintering properties, and can maintain stable performance under various complex process conditions.

5、 Conclusion

Controlling the film thickness uniformity of silver palladium paste in thick film hybrid integrated circuits is an important step in improving circuit performance and reliability. By optimizing the rheological properties of the slurry, improving the printing process, enhancing the flatness of the substrate, and optimizing the sintering process, the film thickness uniformity of silver palladium slurry can be significantly improved.Advanced Institute (Shenzhen) Technology Co., LtdThe research results of its platinum brand thick film hybrid integrated circuit silver palladium paste in this field provide strong support for the manufacturing of thick film hybrid integrated circuits.

With the continuous development of technology, the study of film thickness uniformity of silver palladium paste in thick film hybrid integrated circuits will continue to deepen, and its application in the electronics industry will become increasingly widespread. In the future, we look forward to the emergence of more high-performance silver palladium pastes, making greater contributions to the performance and reliability improvement of electronic products.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.