Under what process conditions is it easy for conductive silver paste in integrated circuits to experience a decrease in conductivity?

Conductive silver paste, as a new type of material that combines conductivity, adhesion, and flexibility, has been widely used in the packaging and bonding of electronic components and assemblies such as liquid crystal displays (LCDs), light emitting diodes (LEDs), integrated circuit (IC) chips, etc. However, under specific process conditions, the conductivity of conductive silver paste may decrease. This article will explore this phenomenon in detail and combine it with Advanced Institute (Shenzhen) Technology Co., LtdResearch Platinum Brand YB6003 Integrated Circuit Conductive Silver AdhesiveAnalyze actual cases.

1、 Factors affecting the conductivity of conductive silver paste

1. Temperature and Humidity

   The conductivity of conductive silver paste may be affected by temperature and humidity. High temperature and high humidity environments may cause fluctuations in conductivity. For example, under conditions of relative humidity exceeding 80% and temperature exceeding 30 ℃, the resistivity of conductive silver paste may increase, thereby affecting its conductivity.

2. oxidize

   If silver particles in conductive silver paste are exposed to air for a long time, they may undergo oxidation, forming a layer of oxide with poor conductivity, resulting in a decrease in conductivity. Research has shown that when the thickness of the oxide layer on the surface of silver particles reaches 5nm, the conductivity will significantly decrease.

3. Substrate and surface treatment

   Different substrates have a certain impact on the bonding strength and conductivity of conductive silver paste. For example, compared to copper substrates, conductive silver paste on aluminum substrates is more susceptible to corrosion, which affects their conductivity. In addition, the cleanliness and treatment methods (such as polishing and sandblasting) of the bonded surface can also affect the conductivity of the conductive silver paste.

4. Storage conditions

   Conductive silver adhesiveDuring storage, if exposed to direct sunlight or in a humid environment, it may lead to a decrease in conductivity. Research shows that after being stored in direct sunlight for one month, the electrical resistivity of conductive silver paste may increase by more than 20%.

2、 Case Study of YB6003 Integrated Circuit Conductive Silver Adhesive with Research Platinum Brand

Advanced Institute (Shenzhen) Technology Co., LtdYB-6001 silver conductive adhesiveIt has won widespread recognition in the market for its outstanding performance. The solid content of this product is as high as 85 ± 1%, ensuring the compactness and durability of the conductive material. Its resistivity is less than 2 × 10 ^ -4 Ω· cm, the electrode thickness is controlled at 8-10 µ m, and the shear strength reaches 120N/cm ². However, even with such high-quality products, there may still be a decrease in conductivity under specific process conditions.

YB6003 integrated circuit conductive silver adhesive from Yanbo brand has the characteristics of high conductivity, strong adhesion, and high temperature resistance. However, in practical applications, if the correct process conditions are not followed, its conductivity may also be affected. For example, during the high-temperature curing process, if the curing time is too long or the temperature is too high, it may cause silver particles to oxidize, thereby affecting the conductivity.

3、 Analysis of the decline in conductivity under specific process conditions

1. High temperature curing

   Under high-temperature curing conditions above 150 ℃, metal particles in conductive silver paste are prone to oxidation, leading to a decrease in conductivity. The recommended curing temperature for YB6003 conductive silver adhesive from Yanbo brand is 130-150 ℃. If it exceeds this range, it may lead to unstable conductivity.

2. Humidity control

   In environments with humidity exceeding 80%, the hygroscopicity of conductive silver paste increases, which may lead to an increase in moisture in the conductive pathway, thereby reducing its conductivity. Especially during storage and use, if humidity is not strictly controlled, it will have adverse effects on conductivity.

3. Improper surface treatment

   If there are impurities such as oil stains, dust, or oxides on the bonded surface, it will affect the bonding strength and conductivity of the conductive silver adhesive.Research Platinum YB6003 Conductive Silver AdhesiveBefore use, the bonded surface should be thoroughly cleaned and treated to improve bonding strength and conductivity.

4. Excessive stretching and squeezing

   When using conductive silver paste, excessive stretching and squeezing may cause uneven distribution or breakage of silver particles in the conductive path, thereby reducing its conductivity. Therefore, excessive stretching and squeezing should be avoided as much as possible during use.

4、 Conclusion and Suggestions

in summary,Integrated Circuit Conductive Silver AdhesiveUnder specific process conditions, it is easy to experience a decrease in conductivity. To ensure the stability and reliability of conductive silver paste, it is recommended to take the following measures:

1. Strictly control environmental conditions: When using and storing conductive silver paste, high temperature and high humidity environments should be avoided to reduce fluctuations in conductivity.
2. Choose appropriate curing conditions: Cure according to the recommended curing temperature and time of the conductive silver adhesive to avoid oxidation problems caused by high temperature curing and long-term curing.
3. Strengthen surface treatment: Before using conductive silver paste, the bonded surface should be thoroughly cleaned and treated to improve bonding strength and conductivity.
4. Avoid excessive stretching and squeezing: During use, try to avoid applying excessive stretching and squeezing to the conductive silver adhesive to extend its service life.

Through the above measures, the risk of conductivity degradation of integrated circuit conductive silver paste under specific process conditions can be effectively reduced, and its stability and reliability can be improved.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.